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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12660698 B1

PDFFull Text
Date of Patent:
Jun. 16, 2026

Filed:

Feb. 08, 2023

Bond head with elastic material around perimeter to improve bonding quality

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Chen-Hua Yu, Hsinchu City, TW;

Chih-Hang Tung, Hsinchu, TW;

Kuo-Chung Yee, Taoyuan City, TW;

Yian-Liang Kuo, Hsinchu City, TW;

Jiun-Yi Wu, Zhongli City, TW;

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;

Attorney:

McClure, Qualey & Rodack, LLP

Primary Examiner:

David A Zarneke

Int. Cl.
CPC ...
H10W 90/00 (2026.01); H10W 72/00 (2026.01); H10W 72/90 (2026.01); H10W 74/01 (2026.01);
U.S. Cl.
CPC ...
H10W 90/00 (2026.01); H10W 74/01 (2026.01); H10W 72/01923 (2026.01); H10W 72/07141 (2026.01); H10W 72/07178 (2026.01); H10W 72/981 (2026.01);
Abstract

A bond head is provided. The bond head includes a bond base, a chuck member, and an elastic material. The chuck member protrudes from a surface of the bond base, and has a chuck surface formed with vacuum holes for holding a die using differential air pressure. In the direction parallel to the chuck surface, the width of the chuck surface is less than the width of the bond base and is equal to or greater than the width of the die. The elastic material is disposed over the chuck surface. The elastic material is arranged around the periphery of the chuck surface to cover edges and/or corners of the chuck surface.

Find Patent Forward Citations

Yu, Chen-Hua. (2026). Bond head with elastic material around perimeter to improve bonding quality (U.S. Patent No. 12660698). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12660698

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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