Yian-Liang Kuo

This inventor holds 39 USPTO granted patents and 5 published patent applications, primarily in Semiconductor Packaging. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2006-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yian-Liang Kuo. Retrieved from https://idiyas.com/inventor/yian-liang-kuo

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 39 (Patent Applications = 5)

% Patents Active = 74.4

Average Co-Inventor Count = 3.2

ph-index = 6

Forward Citations = 204(Granted Patents)

Location History:

Miaoli County, TW (2015)
Toufen Township, TW (2012 - 2019)
Hsinchu, TW (2006 - 2024)

Company Filing History:

39 out of 42,926

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 2006-2026

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Areas of Expertise:

Thermal Dissipation

Interconnect Structures

Under-Bump Metallization

Integrated Circuit Packages

Bond Pad Design

Flip-Chip Packaging

Conductive Bumps

Solder Bumps

Heat Spreader

Insulation Films

Columnar Grain Structures

Packaging Methods

39 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12674835 - Method of analyzing semiconductor structure (2026-07-07),

2. 12660698 - Bond head with elastic material around perimeter to improve bonding quality (2026-06-16),

3. 12431366 - Structure having thermal dissipation structure therein and manufacturing method thereof (2025-09-30),

4. 12159862 - Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices (2024-12-03),

5. 11996368 - Pad structure for enhanced bondability (2024-05-28),

6. 11959958 - Method of analyzing semiconductor structure (2024-04-16),

7. 11935760 - Package structure having thermal dissipation structure therein and manufacturing method thereof (2024-03-19),

8. 11728279 - Pad structure for enhanced bondability (2023-08-15),

9. 11227836 - Pad structure for enhanced bondability (2022-01-18),

10. 10955459 - Method of analyzing semiconductor structure (2021-03-23),

11. 10867975 - Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices (2020-12-15),

12. 10770366 - Integrated circuit packages and methods for forming the same (2020-09-08),

13. 10510635 - Integrated circuit packages and methods for forming the same (2019-12-17),

14. 10453818 - Packaging structures of integrated circuits (2019-10-22),

15. 10340258 - Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices (2019-07-02),

Title: The Innovative Journey of Yian-Liang Kuo

Introduction:

Yian-Liang Kuo, a talented inventor hailing from Toufen, Taiwan, has made significant contributions to the field of technology through his groundbreaking innovations.

Latest Patents:

Yian-Liang Kuo's latest patents focus on advancements in renewable energy technologies, particularly in the development of solar power systems that are more efficient and cost-effective.

Career Highlights:

Throughout his illustrious career, Yian-Liang Kuo has been recognized for his pioneering work in the areas of clean energy and sustainable technologies. His inventions have not only revolutionized the industry but have also had a positive impact on the environment.

Collaborations:

Yian-Liang Kuo has collaborated with leading research institutions and universities to further his research and bring his inventions to life. His partnerships have been instrumental in pushing the boundaries of innovation in the field of renewable energy.

Conclusion:

In conclusion, Yian-Liang Kuo's dedication to innovation and his passion for creating a more sustainable future have solidified his position as a trailblazer in the world of technology. His work continues to inspire and drive progress in the industry.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

5 patents pending: