The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 17, 2019
Filed:
Jun. 29, 2018
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
Chia-Wei Tu, Chunan Town, TW;
Hsien-Wei Chen, Hsinchu, TW;
Tsung-Fu Tsai, Changhua, TW;
Wen-Hsiung Lu, Jhonghe, TW;
Yian-Liang Kuo, Hsinchu, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 21/78 (2006.01); H01L 23/58 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3135 (2013.01); H01L 21/78 (2013.01); H01L 23/585 (2013.01); H01L 24/05 (2013.01); H01L 24/15 (2013.01); H01L 23/3107 (2013.01); H01L 23/3157 (2013.01); H01L 24/03 (2013.01); H01L 24/13 (2013.01); H01L 2224/02331 (2013.01); H01L 2224/02377 (2013.01); H01L 2224/03 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05 (2013.01); H01L 2224/0502 (2013.01); H01L 2224/05022 (2013.01); H01L 2224/05099 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05144 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05186 (2013.01); H01L 2224/05548 (2013.01); H01L 2224/05552 (2013.01); H01L 2224/05567 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/05582 (2013.01); H01L 2224/05599 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/13022 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/94 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/14 (2013.01);
Abstract
A method includes forming an electrical connector over a substrate of a wafer, and molding a polymer layer, with at least a portion of the electrical connector molded in the polymer layer. A first sawing step is performed to form a trench in the polymer layer. After the first sawing step, a second sawing step is performed to saw the wafer into a plurality of dies.