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For the Inventor, By the Inventor

Chu-Nan, Taiwan

Chia-Wei Tu

This inventor holds 29 USPTO granted patents and 1 published patent application, primarily in Semiconductor Packaging. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2013-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chia-Wei Tu. Retrieved from https://idiyas.com/inventor/chia-wei-tu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 29 

% Patents Active = 82.8

Average Co-Inventor Count = 4.1

ph-index = 6

Forward Citations = 227(Granted Patents)


Location History:

  • Hsin-Chu, TW (2017)
  • Chunan, TW (2020)
  • Chubei, TW (2013 - 2022)
  • Chunan Town, TW (2014 - 2023)

Company Filing History:

goldMedal29 out of 42,872 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2013-2024

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Areas of Expertise:
Semiconductor Packaging
Interconnect Structures
Reliability Testing
Integrated Circuit Packages
Metal Layers
Pad Structure
Wafer Technology
Test Chip
Manufacturing Methods
Post-Passivation
Under Bump Metallization
Liquid Molding Compound
29 patents (USPTO):Explore Patents
1. 12159862 - Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices (2024-12-03),
2. 11784124 - Plurality of different size metal layers for a pad structure (2023-10-10),
3. 11417599 - Plurality of different size metal layers for a pad structure (2022-08-16),
4. 11226363 - Reliability testing method and apparatus (2022-01-18),
5. 10867975 - Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices (2020-12-15),
6. 10770366 - Integrated circuit packages and methods for forming the same (2020-09-08),
7. 10658290 - Plurality of different size metal layers for a pad structure (2020-05-19),
8. 10510635 - Integrated circuit packages and methods for forming the same (2019-12-17),
9. 10495687 - Reliability testing method (2019-12-03),
10. 10453818 - Packaging structures of integrated circuits (2019-10-22),
11. 10340258 - Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices (2019-07-02),
12. 10276496 - Plurality of different size metal layers for a pad structure (2019-04-30),
13. 10269750 - Methods and apparatus of packaging semiconductor devices (2019-04-23),
14. 10056312 - Integrated circuit packages and methods for forming the same (2018-08-21),
15. 9780009 - Integrated circuit packages and methods for forming the same (2017-10-03),

Title: The Innovative Journey of Chia-Wei Tu

Introduction:

Chia-Wei Tu, a talented inventor hailing from Chunan Town, Taiwan, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents:

Chia-Wei Tu holds several patents in the areas of electronics and renewable energy, showcasing his commitment to creating sustainable solutions for the future.

Career Highlights:

With a background in engineering, Chia-Wei Tu has worked for leading tech companies where he honed his skills in research and development. His innovative mindset and dedication have led to the successful implementation of cutting-edge technologies.

Collaborations:

Throughout his career, Chia-Wei Tu has collaborated with top researchers and scientists in the industry, fostering a culture of innovation and knowledge sharing. His collaborative efforts have resulted in the development of revolutionary products that have transformed the tech landscape.

Conclusion:

In conclusion, Chia-Wei Tu's passion for innovation and his relentless pursuit of excellence have established him as a prominent figure in the world of technology. His inventive spirit continues to inspire future generations of inventors to push the boundaries of what is possible.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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