IDiyas

For the Inventor, By the Inventor

Chunan Town, Taiwan

Chia-Wei Tu

USPTO Granted Patents = 29 

Average Co-Inventor Count = 4.1

ph-index = 6

Forward Citations = 222(Granted Patents)


Location History:

  • Hsin-Chu, TW (2017)
  • Chunan, TW (2020)
  • Chubei, TW (2013 - 2022)
  • Chunan Town, TW (2014 - 2023)

Company Filing History:

goldMedal29 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2013-2024

where 'Filed Patents' based on already Granted Patents

29 patents (USPTO):
1. 12159862 - Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices (2024-12-03),
2. 11784124 - Plurality of different size metal layers for a pad structure (2023-10-10),
3. 11417599 - Plurality of different size metal layers for a pad structure (2022-08-16),
4. 11226363 - Reliability testing method and apparatus (2022-01-18),
5. 10867975 - Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices (2020-12-15),
6. 10770366 - Integrated circuit packages and methods for forming the same (2020-09-08),
7. 10658290 - Plurality of different size metal layers for a pad structure (2020-05-19),
8. 10510635 - Integrated circuit packages and methods for forming the same (2019-12-17),
9. 10495687 - Reliability testing method (2019-12-03),
10. 10453818 - Packaging structures of integrated circuits (2019-10-22),
11. 10340258 - Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices (2019-07-02),
12. 10276496 - Plurality of different size metal layers for a pad structure (2019-04-30),
13. 10269750 - Methods and apparatus of packaging semiconductor devices (2019-04-23),
14. 10056312 - Integrated circuit packages and methods for forming the same (2018-08-21),
15. 9780009 - Integrated circuit packages and methods for forming the same (2017-10-03),

Title: The Innovative Journey of Chia-Wei Tu

Introduction:

Chia-Wei Tu, a talented inventor hailing from Chunan Town, Taiwan, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents:

Chia-Wei Tu holds several patents in the areas of electronics and renewable energy, showcasing his commitment to creating sustainable solutions for the future.

Career Highlights:

With a background in engineering, Chia-Wei Tu has worked for leading tech companies where he honed his skills in research and development. His innovative mindset and dedication have led to the successful implementation of cutting-edge technologies.

Collaborations:

Throughout his career, Chia-Wei Tu has collaborated with top researchers and scientists in the industry, fostering a culture of innovation and knowledge sharing. His collaborative efforts have resulted in the development of revolutionary products that have transformed the tech landscape.

Conclusion:

In conclusion, Chia-Wei Tu's passion for innovation and his relentless pursuit of excellence have established him as a prominent figure in the world of technology. His inventive spirit continues to inspire future generations of inventors to push the boundaries of what is possible.

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