The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 18, 2022
Filed:
Nov. 22, 2019
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Abstract
A chip reliability testing method includes mounting a first test chip on a test board, wherein the first test chip comprises a silicon device having a plurality of metallization layers configured to establish a plurality of test circuits, a conductive redistribution layer contacting at least one of the plurality of metallization layers, and contact pads on exposed portions of the conductive redistribution layer. The mounting includes bonding the contact pads of the first test chip to corresponding contact pads of the test board. The method further includes applying a test voltage to a first contact pad connected to a first test circuit of the plurality of test circuits and, while maintaining the test voltage, subjecting the first test circuit to a reliability test. The method further includes monitoring an output voltage at a second contact pad connected to the first test circuit during a test period during the reliability test.