Tsung-Fu Tsai

This inventor holds 77 USPTO granted patents and 42 published patent applications, primarily in Semiconductor Packaging. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2012-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tsung-Fu Tsai. Retrieved from https://idiyas.com/inventor/tsung-fu-tsai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 77 (Patent Applications = 42)

% Patents Active = 88.3

Average Co-Inventor Count = 4.1

ph-index = 6

Forward Citations = 205(Granted Patents)

Forward Citations (Not Self Cited) = 169(Dec 10, 2025)

Location History:

Hsin-Chu, TW (2017)
Changhua, TW (2012 - 2024)
Changhua County, TW (2015 - 2024)

Company Filing History:

74 out of 42,810

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

3 out of 465

Taiwan Semiconductor Manufacturing Co., Ltd.

patents

Years Active: 2012-2026

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Areas of Expertise:

Semiconductor Package

Package Structure

Fabrication Method

Underfill

Device Bonding

Photonic Package

Integrated Circuit

Package-on-Package

Inspection Apparatus

Dummy Micro Bumps

Manufacturing Method

Electronic Device

77 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12721170 - Package structure and method of fabricating the same (2026-08-25),

2. 12717096 - Integrated fiber array unit structure including embedded passive optical components and method for forming the same (2026-08-25),

3. 12708011 - Semiconductor device, package structure and method of fabricating the same (2026-08-11),

4. 12681250 - Interposer with planar sidewall surface for optical coupling and methods of forming the same (2026-07-14),

5. 12660707 - Semiconductor device including molded die stack and methods of forming the same (2026-06-16),

6. 12660628 - Package structure and method for forming the same (2026-06-16),

7. 12660620 - Package with improved heat dissipation efficiency and method for forming the same (2026-06-16),

8. 12656635 - Electro-optical device (2026-06-16),

9. 12656544 - Photonic semiconductor device and method of manufacture (2026-06-16),

10. 12628455 - Package structure with lens structure and manufacturing method thereof (2026-05-12),

11. 12598757 - Structure and formation method of package with hybrid interconnection (2026-04-07),

12. 12588554 - Semiconductor device and method forming same (2026-03-24),

13. 12557674 - Package structure and method of fabricating the same (2026-02-17),

14. 12519087 - Package structure with underfill (2026-01-06),

15. 12500195 - Connecting structure, package structure and manufacturing method thereof (2025-12-16),

Title: The Innovative Journey of Inventor Tsung-Fu Tsai

Introduction:

Tsung-Fu Tsai, a talented inventor hailing from Changhua, Taiwan, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents:

Tsung-Fu Tsai's latest patents include cutting-edge advancements in renewable energy technology, smart home devices, and medical equipment, showcasing his versatility and forward-thinking approach.

Career Highlights:

With a career spanning over two decades, Tsung-Fu Tsai has worked tirelessly to bring his ideas to life. His dedication to research and development has led to the creation of several revolutionary products that have improved the lives of many.

Collaborations:

Throughout his career, Tsung-Fu Tsai has collaborated with leading research institutions, universities, and tech companies to further his inventions. These partnerships have allowed him to access resources and expertise that have been instrumental in bringing his ideas to fruition.

Conclusion:

Inventor Tsung-Fu Tsai's passion for innovation and commitment to pushing the boundaries of technology have solidified his reputation as a visionary in the world of inventions. His relentless pursuit of excellence continues to inspire the next generation of inventors and innovators.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

42 patents pending: