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Changhua, Taiwan

Tsung-Fu Tsai

USPTO Granted Patents = 63 (Patent Applications = 34)

Average Co-Inventor Count = 4.1

ph-index = 5

Forward Citations = 183(Granted Patents)

Forward Citations (Not Self Cited) = 169(Dec 10, 2025)

Location History:

Hsin-Chu, TW (2017)
Changhua, TW (2012 - 2024)
Changhua County, TW (2015 - 2024)

Company Filing History:

63 out of 40,780

Taiwan Semiconductor Manufacturing Comp. Ltd.

Years Active: 2012-2025

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Areas of Expertise:

Semiconductor Packages

Package Structure

Integrated Circuit Packages

Photonic Package

Device Bonding Apparatus

Package-on-Package

Underfill Material

Dummy Micro Bumps

Inspection Apparatus

Rework Process

Integrated Fan-Out Packages

Packaging Structures

63 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12500195 - Connecting structure, package structure and manufacturing method thereof (2025-12-16),

2. 12500124 - Method of singulating a semiconductor device (2025-12-16),

3. 12476164 - Semiconductor package and method (2025-11-18),

4. 12412841 - Semiconductor package and manufacturing method thereof (2025-09-09),

5. 12387997 - Semiconductor packages (2025-08-12),

6. 12381177 - Package structure and method of fabricating the same (2025-08-05),

7. 12368128 - Device bonding apparatus and method of manufacturing a package using the apparatus (2025-07-22),

8. 12362245 - Package assembly including a package lid having an inner foot and methods of making the same (2025-07-15),

9. 12353011 - Photonic package and method of manufacture (2025-07-08),

10. 12347708 - Inspection apparatus, manufacturing method of integrated circuit, and inspection method (2025-07-01),

11. 12315806 - Electronic device and manufacturing method thereof (2025-05-27),

12. 12272568 - Semiconductor package and manufacturing method thereof (2025-04-08),

13. 12142579 - Package structure and manufacturing method thereof (2024-11-12),

14. 12142499 - Pickup apparatus and method of using the same (2024-11-12),

15. 12119324 - Package structure (2024-10-15),

Title: The Innovative Journey of Inventor Tsung-Fu Tsai

Introduction:

Tsung-Fu Tsai, a talented inventor hailing from Changhua, Taiwan, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents:

Tsung-Fu Tsai's latest patents include cutting-edge advancements in renewable energy technology, smart home devices, and medical equipment, showcasing his versatility and forward-thinking approach.

Career Highlights:

With a career spanning over two decades, Tsung-Fu Tsai has worked tirelessly to bring his ideas to life. His dedication to research and development has led to the creation of several revolutionary products that have improved the lives of many.

Collaborations:

Throughout his career, Tsung-Fu Tsai has collaborated with leading research institutions, universities, and tech companies to further his inventions. These partnerships have allowed him to access resources and expertise that have been instrumental in bringing his ideas to fruition.

Conclusion:

Inventor Tsung-Fu Tsai's passion for innovation and commitment to pushing the boundaries of technology have solidified his reputation as a visionary in the world of inventions. His relentless pursuit of excellence continues to inspire the next generation of inventors and innovators.

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