The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2026
Filed:
Jul. 19, 2022
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Abstract
Methods of fusion bonding semiconductor dies in packaged semiconductor devices and packaged semiconductor devices formed by the same are disclosed. In an embodiment, a semiconductor package includes a first die including a semiconductor substrate and a through via extending through the semiconductor substrate; a second die bonded to the first die, the second die including a bond pad, the bond pad being physically and electrically coupled to the through via by metal-to-metal bonds; and an encapsulating material on the first die and laterally encapsulating the second die.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile