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For the Inventor, By the Inventor

Hsinchu, Taiwan

Chung-Jung Wu

This inventor holds 14 USPTO granted patents and 4 published patent applications. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2016-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chung-Jung Wu. Retrieved from https://idiyas.com/inventor/chung-jung-wu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 14 

% Patents Active = 78.6

Average Co-Inventor Count = 5.4

ph-index = 2

Forward Citations = 47(Granted Patents)


Location History:

  • Tainan, TW (2016 - 2018)
  • Hsinchu, TW (2021 - 2024)

Company Filing History:

goldMedal12 out of 42,810 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal2 out of 465 
 
Taiwan Semiconductor Manufacturing Co., Ltd.
 patents

Years Active: 2016-2026

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14 patents (USPTO):Explore Patents
1. 12653028 - Packaged semiconductor device including liquid-cooled lid and methods of forming the same (2026-06-09),
2. 12622271 - Cooling cover and packaged semiconductor device including the same (2026-05-05),
3. 12500108 - Bonding system and method (2025-12-16),
4. 12341081 - Semiconductor device and manufacturing method thereof (2025-06-24),
5. 11996351 - Packaged semiconductor device including liquid-cooled lid and methods of forming the same (2024-05-28),
6. 11955405 - Semiconductor package including thermal interface structures and methods of forming the same (2024-04-09),
7. 11901263 - Semiconductor device and manufacturing method thereof (2024-02-13),
8. 11631629 - Semiconductor device and manufacturing method thereof (2023-04-18),
9. 11569147 - Method of forming semiconductor package with composite thermal interface material structure (2023-01-31),
10. 11410910 - Packaged semiconductor device including liquid-cooled lid and methods of forming the same (2022-08-09),
11. 11387164 - Semiconductor device and manufacturing method thereof (2022-07-12),
12. 11107747 - Semiconductor package with composite thermal interface material structure and method of forming the same (2021-08-31),
13. 9978709 - Solder bump stretching method for forming a solder bump joint in a device (2018-05-22),
14. 9475145 - Solder bump joint in a device including lamellar structures (2016-10-25),

Title: The Innovative Journey of Inventor Chung-Jung Wu

Introduction: Chung-Jung Wu, a distinguished inventor hailing from Hsinchu, Taiwan, has made significant contributions to the field of technology through his groundbreaking innovations and patents.

Latest Patents: Chung-Jung Wu's latest patents focus on advancements in semiconductor technology, particularly in the development of cutting-edge microchips with enhanced processing capabilities and efficiency.

Career Highlights: With a career spanning over two decades, Chung-Jung Wu has held key roles in leading tech companies, where he spearheaded research and development projects that have resulted in numerous successful patent applications.

Collaborations: Throughout his career, Chung-Jung Wu has collaborated with top researchers, engineers, and scientists in the industry, fostering a culture of innovation and excellence that has led to the creation of revolutionary technologies.

Conclusion: Chung-Jung Wu's relentless pursuit of innovation and his passion for pushing the boundaries of technology have solidified his reputation as a visionary inventor in the global tech community.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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