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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9978709 B1

PDFFull Text
Date of Patent:
May. 22, 2018

Filed:

Sep. 26, 2016

Solder bump stretching method for forming a solder bump joint in a device

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Su-Chun Yang, Hsinchu, TW;

Chung-Jung Wu, Tainan, TW;

Hsiao-Yun Chen, Hsinchu, TW;

Yi-Li Hsiao, Hsinchu, TW;

Chih-Hang Tung, Hsinchu, TW;

Da-Yuan Shih, Hsinchu, TW;

Chen-Hua Yu, Hsinchu, TW;

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;

Attorney:

Hauptman Ham, LLP

Primary Examiner:

Lex Malsawma

Assistant Examiner:

Eric W Jones

Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 23/00 (2006.01); B23K 1/00 (2006.01); H01L 23/498 (2006.01); B23K 35/02 (2006.01); B23K 35/26 (2006.01); C22C 13/00 (2006.01); B23K 101/40 (2006.01); B23K 103/08 (2006.01);
U.S. Cl.
CPC ...
H01L 24/81 (2013.01); B23K 1/0016 (2013.01); B23K 35/0244 (2013.01); B23K 35/262 (2013.01); C22C 13/00 (2013.01); H01L 23/49811 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); B23K 2201/40 (2013.01); B23K 2203/08 (2013.01); H01L 2224/1132 (2013.01); H01L 2224/1134 (2013.01); H01L 2224/1145 (2013.01); H01L 2224/11334 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13014 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13113 (2013.01); H01L 2224/13116 (2013.01); H01L 2224/13118 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/16057 (2013.01); H01L 2224/16058 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16506 (2013.01); H01L 2224/16507 (2013.01); H01L 2224/8193 (2013.01); H01L 2224/81121 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/81947 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/3841 (2013.01);
Abstract

A method of producing a solder bump joint includes heating a solder bump comprising tin above a melting temperature of the solder bump, wherein the solder bumps comprises eutectic Sn—Bi compound, and the eutectic Sn—Bi compound is free of Ag. The method further includes stretching the solder bump to increase a height of the solder bump, wherein stretching the solder bump forms lamellar structures having a contact angle of less than 90°. The method further includes cooling down the solder bump.

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