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For the Inventor, By the Inventor

Hsin-Chu, Taiwan

Da-Yuan Shih

USPTO Granted Patents = 16 

Average Co-Inventor Count = 3.7

ph-index = 5

Forward Citations = 208(Granted Patents)


Company Filing History:

goldMedal16 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2013-2022

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16 patents (USPTO):Explore Patents
1. 11257767 - Interconnect crack arrestor structure and methods (2022-02-22),
2. 10340226 - Interconnect crack arrestor structure and methods (2019-07-02),
3. 10034390 - Metal post bonding using pre-fabricated metal posts (2018-07-24),
4. 9978709 - Solder bump stretching method for forming a solder bump joint in a device (2018-05-22),
5. 9679882 - Method of multi-chip wafer level packaging (2017-06-13),
6. 9521795 - Two-step direct bonding processes and tools for performing the same (2016-12-13),
7. 9475145 - Solder bump joint in a device including lamellar structures (2016-10-25),
8. 9263407 - Method for manufacturing a plurality of metal posts (2016-02-16),
9. 9230932 - Interconnect crack arrestor structure and methods (2016-01-05),
10. 9216469 - Indirect printing bumping method for solder ball deposition (2015-12-22),
11. 9082763 - Joint structure for substrates and methods of forming (2015-07-14),
12. 8927877 - Looped interconnect structure (2015-01-06),
13. 8803333 - Three-dimensional chip stack and method of forming the same (2014-08-12),
14. 8754514 - Multi-chip wafer level package (2014-06-17),
15. 8685798 - Methods for forming through vias (2014-04-01),

Title: Da-Yuan Shih: Innovator in Semiconductor Technology

Introduction

Da-Yuan Shih is a prominent inventor based in Hsin-Chu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 16 patents. His innovative work focuses on enhancing the reliability and performance of semiconductor devices.

Latest Patents

One of Da-Yuan Shih's latest patents is the "Interconnect crack arrestor structure and methods." This invention provides a system and method for preventing cracks in semiconductor connections. An embodiment of this patent involves placing crack stoppers into the connection between a semiconductor die and a substrate. The crack stoppers can be designed as hollow or solid cylinders, strategically positioned to prevent cracks from propagating through them.

Career Highlights

Da-Yuan Shih is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work at this company has allowed him to develop and refine his innovative ideas, contributing to advancements in semiconductor technology.

Collaborations

Throughout his career, Da-Yuan Shih has collaborated with notable colleagues, including Chen-Hua Douglas Yu and Chih-Hang Tung. These collaborations have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Da-Yuan Shih's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the industry. His innovative solutions continue to shape the future of semiconductor devices.

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