The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 13, 2016
Filed:
Apr. 19, 2013
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Inventors:
Yi-Li Hsiao, Hsin-Chu, TW;
Da-Yuan Shih, Hsin-Chu, TW;
Chih-Hang Tung, Hsin-Chu, TW;
Chen-Hua Yu, Hsin-Chu, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 31/00 (2006.01); B23K 31/02 (2006.01); H05K 13/04 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 13/0465 (2013.01); H01L 24/75 (2013.01); H01L 24/81 (2013.01); H01L 24/97 (2013.01); H01L 2224/13124 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/13164 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/757 (2013.01); H01L 2224/7598 (2013.01); H01L 2224/75102 (2013.01); H01L 2224/75251 (2013.01); H01L 2224/75703 (2013.01); H01L 2224/75985 (2013.01); H01L 2224/75987 (2013.01); H01L 2224/75988 (2013.01); H01L 2224/8109 (2013.01); H01L 2224/81065 (2013.01); H01L 2224/81093 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/97 (2013.01);
Abstract
A method includes placing a plurality of first package components over second package components, which are included in a third package component. First metal connectors in the first package components are aligned to respective second metal connectors of the second package components. After the plurality of first package components is placed, a metal-to-metal bonding is performed to bond the first metal connectors to the second metal connectors.