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Yi-Li Hsiao

This inventor holds 50 USPTO granted patents and 8 published patent applications, primarily in Semiconductor Packaging. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2003-2025.

USPTO Granted Patents = 50 (Patent Applications = 8)

% Patents Active = 58.0

Average Co-Inventor Count = 4.1

ph-index = 6

Forward Citations = 108(Granted Patents)

Forward Citations (Not Self Cited) = 94(Dec 10, 2025)

Location History:

Chiai, TW (2003)
Ta-Lin, TW (2003)
Hsinhu, TW (2019)
Hsinchu, TW (2008 - 2024)

Company Filing History:

50 out of 42,711

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 2003-2025

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Areas of Expertise:

Bonding Process

Cooling Structure

Bump Formation

Solder Bump

Semiconductor Device

Stud Bump

Pick-and-Place Tool

Metallization Processing

Dipping Plate

Void Reduction

Cluster Processing

Chemical Etching

50 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12463175 - Bonding with pre-deoxide process and apparatus for performing the same (2025-11-04),

2. 12027446 - Method for forming a semiconductor component with a cooling structure (2024-07-02),

3. 11955378 - Bonding method of package components and bonding apparatus (2024-04-09),

4. 11515233 - Semiconductor component with cooling structure (2022-11-29),

5. 11443981 - Bonding method of package components and bonding apparatus (2022-09-13),

6. 11348889 - Semiconductor device and bump formation process (2022-05-31),

7. 11342302 - Bonding with pre-deoxide process and apparatus for performing the same (2022-05-24),

8. 10522491 - Semiconductor device and bump formation process (2019-12-31),

9. 10229901 - Immersion interconnections for semiconductor devices and methods of manufacture thereof (2019-03-12),

10. 10163835 - Solder bump stretching method (2018-12-25),

11. 10147693 - Methods for stud bump formation (2018-12-04),

12. 10034390 - Metal post bonding using pre-fabricated metal posts (2018-07-24),

13. 9978709 - Solder bump stretching method for forming a solder bump joint in a device (2018-05-22),

14. 9966357 - Pick-and-place tool for packaging process (2018-05-08),

15. 9960134 - Semiconductor device and bump formation process (2018-05-01),

Title: The Innovative Journey of Inventor Yi-Li Hsiao

Introduction: Yi-Li Hsiao is a pioneering inventor hailing from Hsinchu, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Yi-Li Hsiao holds several patents in the areas of semiconductor technology, renewable energy, and artificial intelligence, showcasing his versatility and forward-thinking approach to invention.

Career Highlights: With a career spanning over two decades, Yi-Li Hsiao has worked with leading tech companies and research institutions, spearheading projects that have pushed the boundaries of what is possible in the world of innovation.

Collaborations: Throughout his career, Yi-Li Hsiao has collaborated with top engineers, scientists, and researchers from around the globe, fostering a culture of creativity and excellence in all his projects.

Conclusion: Yi-Li Hsiao's relentless pursuit of innovation and his passion for creating solutions to complex problems have solidified his reputation as a visionary inventor in the ever-evolving landscape of technology.

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