The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 08, 2018

Filed:

Jul. 28, 2015
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Inventors:

Chien Ling Hwang, Hsin-Chu, TW;

Ying-Jui Huang, Zhubei, TW;

Yi-Li Hsiao, Hsin-Chu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/00 (2006.01); H01L 23/00 (2006.01); B23K 1/20 (2006.01); B23K 3/08 (2006.01); B23K 3/047 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 24/97 (2013.01); B23K 1/0016 (2013.01); B23K 1/203 (2013.01); B23K 3/047 (2013.01); B23K 3/082 (2013.01); H01L 21/67144 (2013.01); H01L 24/75 (2013.01); H01L 24/81 (2013.01); H01L 24/95 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/759 (2013.01); H01L 2224/7565 (2013.01); H01L 2224/7598 (2013.01); H01L 2224/75183 (2013.01); H01L 2224/75702 (2013.01); H01L 2224/75753 (2013.01); H01L 2224/81024 (2013.01); H01L 2224/81122 (2013.01); H01L 2224/81169 (2013.01); H01L 2224/81801 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/15311 (2013.01);
Abstract

A method includes moving a first bond head along a first guide apparatus for a first loop. The first guide apparatus is configured in a ring shape. The method also includes picking up a first die using the first bond head during the first loop, and aligning the first die with a first package substrate. The aligning the first die with the first package substrate includes moving the first package substrate in a first direction and a second direction. The first direction and the second direction are contained in a first plane parallel to the first loop. The method further includes placing the first die over the first package substrate during the first loop.


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