The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 2022
Filed:
Dec. 20, 2019
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
Yi-Li Hsiao, Hsinchu, TW;
Chen-Hua Yu, Hsinchu, TW;
Shin-Puu Jeng, Hsinchu, TW;
Chih-Hang Tung, Hsinchu, TW;
Cheng-Chang Wei, Taipei, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 23/00 (2006.01); H01L 21/44 (2006.01); H01L 21/768 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 24/11 (2013.01); H01L 21/44 (2013.01); H01L 21/76885 (2013.01); H01L 23/49811 (2013.01); H01L 23/52 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 24/03 (2013.01); H01L 2224/0347 (2013.01); H01L 2224/0361 (2013.01); H01L 2224/03912 (2013.01); H01L 2224/10126 (2013.01); H01L 2224/10145 (2013.01); H01L 2224/11 (2013.01); H01L 2224/1147 (2013.01); H01L 2224/11823 (2013.01); H01L 2224/11825 (2013.01); H01L 2224/11849 (2013.01); H01L 2224/13018 (2013.01); H01L 2224/13562 (2013.01); H01L 2224/13565 (2013.01); H01L 2224/80815 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/14 (2013.01);
Abstract
A semiconductor device includes a solder bump overlying and electrically connected to a pad region, and a metal cap layer formed on at least a portion of the solder bump. The metal cap layer has a melting temperature greater than the melting temperature of the solder bump.