Company Filing History:
Years Active: 2016-2022
Title: Cheng-Chang Wei: Innovator in Semiconductor Technology
Introduction
Cheng-Chang Wei is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 6 patents. His work focuses on innovative semiconductor devices and fabrication processes that enhance performance and reliability.
Latest Patents
Cheng-Chang Wei's latest patents include groundbreaking inventions such as a semiconductor device and bump formation process. This patent describes a semiconductor device that features a solder bump overlying and electrically connected to a pad region, with a metal cap layer formed on at least a portion of the solder bump. The metal cap layer is designed to have a melting temperature greater than that of the solder bump, ensuring durability and efficiency. Another notable patent is for a semiconductor device and method for fabricating the same. This invention includes a substrate with two transistors, each having distinct gate electrodes and filter layers, which optimize their performance by varying their threshold voltages and filter layer thicknesses.
Career Highlights
Cheng-Chang Wei is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His role involves developing advanced semiconductor technologies that push the boundaries of current capabilities. His innovative approach has positioned him as a key player in the field.
Collaborations
Cheng-Chang Wei has collaborated with notable colleagues such as Yi-Li Hsiao and Chen-Hua Douglas Yu. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.
Conclusion
Cheng-Chang Wei's contributions to semiconductor technology are noteworthy and impactful. His innovative patents and collaborations reflect his commitment to advancing the field. His work continues to influence the future of semiconductor devices and fabrication processes.