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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11569147 B1

PDFFull Text
Date of Patent:
Jan. 31, 2023

Filed:

Aug. 25, 2021

Method of forming semiconductor package with composite thermal interface material structure

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Tung-Liang Shao, Hsinchu, TW;

Jen-Yu Wang, Hsinchu, TW;

Chung-Jung Wu, Hsinchu, TW;

Chih-Hang Tung, Hsinchu, TW;

Chen-Hua Yu, Hsinchu, TW;

Assignee:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Nathan W Ha

Int. Cl.
CPC ...
H01L 23/42 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 25/18 (2006.01);
U.S. Cl.
CPC ...
H01L 23/42 (2013.01); H01L 21/563 (2013.01); H01L 23/315 (2013.01); H01L 23/3128 (2013.01); H01L 24/17 (2013.01); H01L 24/33 (2013.01); H01L 24/73 (2013.01); H01L 25/18 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/73253 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1434 (2013.01);
Abstract

A method of forming a semiconductor package is provided. The method includes forming a metallization stack over a semiconductor die. Polymer particles are mounted over the metallization stack. Each of the polymer particles is coated with a first bonding layer. A heat spreader lid is bonded with the semiconductor die by reflowing the first bonding layer. A composite thermal interface material (TIM) structure is formed between the heat spreader lid and the semiconductor die during the bonding. The composite TIM structure includes the first bonding layer and the polymer particles embedded in the first bonding layer.

Find Patent Forward Citations

Shao, Tung-Liang. (2023). Method of forming semiconductor package with composite thermal interface material structure (U.S. Patent No. 11569147). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11569147

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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