This inventor holds 285 USPTO granted patents and 39 published patent applications and 20 EPO patents, primarily in Microelectronics Packaging (CPC class H01L25-0657). Top assignees: Adeia Semiconductor Bonding Technologies Inc., Perceive Corporation, Adeia Semiconductor Solutions LLC. Active years: 2003-2026.
Inventors with similar research interests:
Location History:
- Charlotte, NC (US) (2015)
- San Clara, CA (US) (2014 - 2016)
- San Jose, CA (US) (2003 - 2023)
- Santa Clara, CA (US) (2005 - 2024)
Company Filing History:
267 out of 1,907 
6 out of 83 
2 out of 30 
Years Active: 2003-2026
Areas of Expertise:
Title: Ilyas Mohammed: A Trailblazer in Integrated Circuit Innovations
Introduction:
In the fast-paced world of technology, few inventors have made a mark as significant as Ilyas Mohammed. Based in Santa Clara, CA, Ilyas has garnered remarkable achievements during his career in the field of integrated circuit design. With an impressive portfolio of 256 patents, his contributions have revolutionized the industry. This article delves into Ilyas Mohammed's latest patents, highlights his distinguished career, explores his collaborations, and pays tribute to his remarkable achievements.
Latest Patents:
Ilyas Mohammed has recently obtained two groundbreaking patents that represent the cutting-edge of integrated circuit technology.
1. Bonded structures with integrated passive component:
This patent introduces bonded structures that combine elements with passive electronic components. The structure consists of an element, a passive electronic component, and terminals. The innovative design enhances performance and integration capabilities, providing new possibilities for the development of smaller, more powerful electronic devices.
2. 3D chip with shared clock distribution network:
In this patent, Ilyas Mohammed unveils a three-dimensional (3D) circuit architecture. By stacking multiple integrated circuit (IC) dies together, these circuits can utilize shared interconnect layers to distribute power, clock signals, and data-bus signals. This innovative approach enables improved efficiency, reduced power consumption, and increased functionality in electronic devices.
Career Highlights:
Ilyas Mohammed has made significant contributions to the industry throughout his illustrious career. His dedication and expertise have earned him well-deserved recognition. Notably, he has worked with prominent companies such as Tessera, Inc. and Invensas Corporation (previously known as Ziptronix, Inc).
Collaborations:
During his career, Ilyas Mohammed has had the privilege of collaborating with numerous talented individuals, including two notable colleagues:
1. Belgacem Haba:
Belgacem Haba, an esteemed professional in the field, has worked alongside Ilyas Mohammed. Their combined efforts have led to groundbreaking advancements in integrated circuit design, enabling the realization of cutting-edge technologies.
2. Vage Oganesian:
Vage Oganesian, another accomplished collaborator, has shared his expertise with Ilyas Mohammed. Their partnership has resulted in the development of innovative solutions, propelling the field of integrated circuits forward.
Conclusion:
Ilyas Mohammed's remarkable journey as an inventor and his immense contributions in the field of integrated circuit design have left an indelible mark on the industry. With 256 patents to his name, including the ground-breaking patents on bonded structures with integrated passive components and 3D chips with shared clock distribution networks, Ilyas Mohammed continues to shape the future of technology. His collaborations with talented professionals, such as Belgacem Haba and Vage Oganesian, have furthered the progress of integrated circuit innovation. Ilyas Mohammed's pioneering work and unwavering commitment to excellence serve as an inspiration for aspiring inventors and engineers worldwide.