The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 2024

Filed:

Dec. 29, 2022
Applicant:

Adeia Semiconductor Bonding Technologies Inc., San Jose, CA (US);

Inventors:

Belgacem Haba, Saratoga, CA (US);

Ilyas Mohammed, Santa Clara, CA (US);

Rajesh Katkar, Milpitas, CA (US);

Gabriel Z. Guevara, San Jose, CA (US);

Javier A. DeLaCruz, San Jose, CA (US);

Shaowu Huang, Sunnyvale, CA (US);

Laura Willis Mirkarimi, Sunol, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01G 2/02 (2006.01); H01G 4/12 (2006.01); H01G 4/228 (2006.01); H01G 4/30 (2006.01); H01G 4/38 (2006.01); H01G 4/40 (2006.01); H01L 23/00 (2006.01); H01L 23/48 (2006.01); H01L 23/522 (2006.01); H01L 23/66 (2006.01); H05K 1/18 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01G 2/02 (2013.01); H01G 4/1245 (2013.01); H01G 4/228 (2013.01); H01G 4/30 (2013.01); H01G 4/40 (2013.01); H01L 23/48 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/5223 (2013.01); H01L 24/08 (2013.01); H01L 24/32 (2013.01); H05K 1/18 (2013.01); H01G 4/38 (2013.01); H01L 23/49816 (2013.01); H01L 23/66 (2013.01); H01L 24/05 (2013.01); H01L 24/80 (2013.01); H01L 2223/6666 (2013.01); H01L 2223/6672 (2013.01); H01L 2224/03845 (2013.01); H01L 2224/05005 (2013.01); H01L 2224/05017 (2013.01); H01L 2224/05556 (2013.01); H01L 2224/05567 (2013.01); H01L 2224/05576 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05686 (2013.01); H01L 2224/0807 (2013.01); H01L 2224/08265 (2013.01); H01L 2224/16265 (2013.01); H01L 2224/32265 (2013.01); H01L 2224/80203 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/80896 (2013.01); H01L 2224/80948 (2013.01); H01L 2924/19011 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19103 (2013.01); H05K 1/0231 (2013.01); H05K 1/185 (2013.01); H05K 2201/10015 (2013.01);
Abstract

In various embodiments, a bonded structure is disclosed. The bonded structure can include an element and a passive electronic component having a first surface bonded to the element and a second surface opposite the first surface. The passive electronic component can comprise a first anode terminal bonded to a corresponding second anode terminal of the element and a first cathode terminal bonded to a corresponding second cathode terminal of the element. The first anode terminal and the first cathode terminal can be disposed on the first surface of the passive electronic component.


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