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San Jose, CA, United States of America

Adeia Semiconductor Bonding Technologies Inc.

USPTO Granted Patents = 1,857

EPO Patents = 7

Trademarks = 4

Forward Citations = 40,662

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479 inventors (with patents filed for the assignee):

Belgacem Haba (594 out of 646 patents)

Cyprian Emeka Uzoh (263 out of 408 patents)

Ilyas Mohammed (258 out of 279 patents)

4. Rajesh Katkar (196 out of 209 patents)

5. Thomas H DiStefano (165 out of 193 patents)

6. Wael Zohni (141 out of 145 patents)

7. Peter Corcoran (134 out of 334 patents)

8. John W Smith (123 out of 124 patents)

9. Joseph Charles Fjelstad (117 out of 183 patents)

10. Javier A DeLaCruz (115 out of 131 patents)

11. Craig S Mitchell (110 out of 112 patents)

12. Liang Wang (105 out of 122 patents)

13. Eran Steinberg (100 out of 272 patents)

14. Guilian Gao (98 out of 110 patents)

15. Petronel Bigioi (93 out of 268 patents)

Core Competencies:

Through-Substrate Vias

Direct Bonding

Heterogeneous Annealing

Microelectronic Assemblies

Stacked Devices

Integrated Cooling Systems

Electrical Redundancy

Conductive Barriers

Bonded Structures

Thermal Performance

Optical Waveguides

Fluid Channel Geometry

1,857 patents: Sort by Forward Citations

1. 12513855 - Integrated cooling assembly with upper and lower channels (2025-12-30),

2. 12512425 - Expansion controlled structure for direct bonding and method of forming same (2025-12-30),

3. 12506114 - Directly bonded metal structures having aluminum features and methods of preparing same (2025-12-23),

4. 12500138 - Cooling channel shape with substantially constant cross sectional area (2025-12-16),

5. 12482776 - Metal pads over TSV (2025-11-25),

6. 12456662 - Structures with through-substrate vias and methods for forming the same (2025-10-28),

7. 12451445 - Protective elements for bonded structures (2025-10-21),

8. 12451439 - Bonded structure including an obstructive element directly bonded to a semiconductor element without an adhesive (2025-10-21),

9. 12438129 - Heterogeneous annealing method and device (2025-10-07),

10. 12438122 - DBI to Si bonding for simplified handle wafer (2025-10-07),

11. 12431460 - Die processing (2025-09-30),

12. 12431449 - Circuitry for electrical redundancy in bonded structures (2025-09-30),

13. 12424584 - Direct bonding methods and structures (2025-09-23),

14. 12417950 - Mitigating surface damage of probe pads in preparation for direct bonding of a substrate (2025-09-16),

15. 12412808 - Cold plate and manifold integration for high reliability (2025-09-09),

ADEIA Semiconductor Bonding Technologies Inc. is a leading provider of innovative semiconductor bonding solutions. With a strong focus on research and development, ADEIA delivers advanced bonding technologies that enable faster, more reliable, and higher-performing semiconductor devices. Our expertise lies in developing cutting-edge bonding materials, manufacturing processes, and equipment to meet the ever-evolving needs of the semiconductor industry. Visit our website to learn more about our products and services.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 30 2025

1,857 Patents

#14 in San Jose, CA

#65 in California

#266 in US

#527 in the World

San Jose, CA, United States of America

Adeia Semiconductor Bonding Technologies Inc.

Forward Citations = 40,662

479 inventors:

Belgacem Haba (594 out of 646 patents)

Cyprian Emeka Uzoh (263 out of 408 patents)

Ilyas Mohammed (258 out of 279 patents)

4. Rajesh Katkar (196 out of 209 patents)

5. Thomas H DiStefano (165 out of 193 patents)

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