Thomas H DiStefano

Title: Thomas H Distefano: Innovating Microelectronic Assembly Processes

Introduction:

Thomas H Distefano is a highly accomplished inventor and researcher in the field of microelectronic assemblies. With an impressive portfolio of 90 patents, Distefano has made significant contributions to the development of encapsulation techniques and fabrication methods for microelectronic devices. This article explores some of his latest patents, as well as his professional affiliations and collaborations.

Latest Patents:

One of Distefano's recent patents is titled "Encapsulation of microelectronic assemblies," which introduces a novel approach to encapsulating microelectronic assemblies using disposable frames. This method involves placing the assemblies within an aperture defined by a frame, covering the aperture with top and bottom sealing layers, and injecting the encapsulant into the enclosed space. By eliminating the need for the frame to be held in the encapsulation fixture during curing, this process achieves a higher throughput.

Another notable patent by Distefano is the "Method for fabricating microelectronic assemblies." This patent describes a technique for forming solder pads with solder-wettable strips that extend radially from a central point. The configuration of the pads helps center and position the solder balls accurately, minimizing variations in bump height. Additionally, the solder pads may include non-wettable areas, which eliminate the requirement for a separate solder mask and aid in confining the solder.

Professional Affiliations:

Distefano has been associated with Tessera, Inc., a renowned company in the microelectronics industry. Tessera, Inc., formerly known as Digital Optics Corporation, specializes in developing miniaturization technologies for electronic devices. Distefano's contributions to microelectronic assembly techniques align well with Tessera's focus on innovation in this domain. His collaboration with Tessera, Inc. suggests a fruitful working relationship and a shared commitment to advancing the field.

Colleagues at Tessera, Inc.:

Within Tessera, Inc., Distefano collaborated with esteemed individuals such as John W Smith and Joseph Fjelstad. These colleagues likely contributed to the collective expertise and enriched the discussion surrounding microelectronic assembly processes. Through their collaborative efforts, Distefano and his coworkers may have achieved breakthrough advancements in the field.

Conclusion:

Thomas H Distefano's notable contributions to encapsulation and fabrication techniques for microelectronic devices have significantly influenced the industry. His patented innovations demonstrate an emphasis on high throughput, precise positioning, and improved efficiency in microelectronic assembly. Collaborating with prominent companies like Tessera, Inc., and working alongside accomplished colleagues, Distefano's research and inventions have undoubtedly left a lasting impact on the field of microelectronics.