Adeia Semiconductor Bonding Technologies Inc.

International Business Machines Corporation

Palo Alto Research Center Inc.

Ist Associates, Inc.

Ppg Industries Ohio, Inc.

Centipede Systems, Inc.

Iessera, Inc.

Tessera LLC

Thomas H DiStefano

John W Smith

Joseph Charles Fjelstad

Igor Y Khandros

Craig S Mitchell

Zlata Kovac

Konstantine N Karavakis

Gary W Grube

Masud Beroz

David Noel Light

Belgacem Haba

Jerome J Cuomo

David A Gibson

Gaetan L Mathieu

Robert Rosenberg

Kie Y Ahn

David Kirtland Fork

Eugene Michael Chow

Meng H Lean

Armin R Volkel

Anthony B Faraci

James B Zaccardi

Tony Faraci

A Christian Walton

Gaetan Mathiew

Scott G Ehrenberg

Jason Sweis

Tan Nguyen

Gus Karavakis

John W Smith, Jr

John A Grange

Matthew T Hendrickson

Laurie Union

Michel A Rosa

Mark A Johnson

Koenraad F Van Schuylenbergh

Armin Rainer Völkel

Christopher M Pickett

Vernon Solberg

Owais Jamil

Pieter H Bellaar

Jerry M Woodall

Flynn P Carson

Alan E Wang

Kevin C Olson

Robert Stephen Olyha, Jr

Arnold Halperin

John Cocke

King-Ning Tu

Michael Warner

Hung-Ming Wang

Ralph L Hollis, Jr

John D Mackay

Lawrence Kuhn

Kurt Raab

Victor B Jipson

Sherman S Wang

David R Baker

Arthur E Falls

Anthony J Castellano, Jr

Ga&eacute;tan Mathiew

Joseph Fjeslstad

Ga&egrave;tan Mathiew

Mark Thorson

Thomas Pickett

John E Baglin

Koenraad F Vanschuylenbergh

A method of providing a substantially void free layer for one or more flip chip assemblies, or one or more microelectronic components, utilizing a curable encapsulant. Also disclosed is a method of injecting an encapsulant into an assembly and a method of treating a microelectronic component to form a void free layer.

Methods for providing void-free layer for semiconductor assemblies

Systems and methods are provided for fabricating compliant spring contacts for use in, for example, IC packaging and interconnection between multi-layers in stacked IC packages and electronic components. Internal stresses generated within an formed film are released to cause the film to buckle and/or bow away from a supporting terminal. A thin stressed metal film layer is selectively broken away from the substrate of the supporting terminal allowing the stressed metal film to take on a bowed and/or spring-like shaped through minute deformation based on a release of the internal stresses. The resultant thin compliant spring contact can deform a small amount as the spring contact is then pressed against a compatible mating contact surface in an overlying layer.

Methods for fabricating thin complaint spring contacts

Provided is a method of forming a circuit board including (a) providing a first conductive sheet; (b) selectively removing one or more portions of the first conductive sheet to form a first panel having a first circuit board that is coupled to a disposable part of the first panel by at least one tab that extends from an edge of the first circuit board to an edge of the disposable part of the first panel; (c) applying an insulating coating to the first circuit board so that at least each edge of the first circuit board is covered thereby; and (d) separating the first circuit board from the disposable part in a manner whereupon at least part of the tab remains attached to the first circuit board and includes an exposed edge of the conductive sheet of the first circuit board. Circuit boards formed by the method are also provided.

Circuit board and method of manufacture thereof

A method of making a microelectronic package includes providing a first microelectronic element having electrically conductive parts and including first and second surfaces and providing a compliant element including a releasable adhesive over the first surface of the first microelectronic element. A second microelectronic element having electrically conductive parts is abutted against the releasable adhesive so that the second microelectronic element is releasably assembled to the first microelectronic element and the electrically conductive parts of the first and second microelectronic elements are connected to one another. The releasably assembled package is tested to determine whether the package has been properly assembled. A curable liquid is then introduced between the first and second microelectronic elements of a properly assembled package and the curable liquid is cured to permanently assemble the first and second microelectronic elements together.

Method of fabricating semiconductor chip assemblies

A socket connector for connecting a post or ball wherein the female element grips the post with resilient prongs with end tips at low insertion force but positive contact is maintained and wherein attempted withdrawal is normally inhibited by increasing force applied to the post by the female element in response to the withdrawal force. The female element comprises a tube of resilient conductive material that has been sliced or helically partitioned into opposing helical prongs so as to allow the prongs of the connector to spirally open around the post or ball-like bump and mechanically grip the post or bump as the post or bump is inserted along the longitudinal axis of the tube. The tubular element may be made by forming helical prongs in the end of a tube in helical cuts from about a mid section to one end of the tube.

High performance electrical connector

An assembly includes a structure, a plurality of terminals and a plurality of compliant pads disposed between said terminals and said structure. The terminals are aligned with at least some of said pads, with the pads providing a standoff between the structure and the terminals. The compliant pads are preferably made of a non-conductive material such as a silicone elastomer.

Methods of making microelectronic assemblies including compliant interfaces

Semiconductor chip assemblies incorporating flexible, sheet-like elements having terminals thereon overlying the front or rear face of the chip to provide a compact unit. The terminals on the sheet-like element are movable with respect to the chip, so as to compensate for thermal expansion. A resilient element such as a compliant layer interposed between the chip and terminals permits independent movement of the individual terminals toward the chip driving engagement with a test probe assembly so as to permit reliable engagement despite tolerances.

Semiconductor chip assemblies, methods of making same and components for same

A microelectronic component comprising a dielectric layer having an opening and leads extending across the opening is disclosed. The leads have an offset portion. A method of making a microelectronic assembly comprises connecting each of the leads to a contact on a microelectronic element. A semiconductor chip assembly has a microelectronic component with an opening and leads extending across the opening. The leads are connected to contacts on a semiconductor chip and have at least one twisted portion.

Microelectronic component and assembly having leads with offset portions

A novel method of forming a released metal spring structure is described. In the method, a release layer including a blowing agent is deposited, usually printed, over portions of a substrate. A metal film is deposited over both the release layer and the substrate. The release layer is then heated such that the blowing agent decomposes releasing a portion of the metal film. The metal film curls out of the plane of the substrate to form a spring structure.

Method of electroplating stressed metal springs

A packaged semiconductor chip including the chip, and a package element such as a heat sink is made by connecting flexible leads between contacts on the chip and terminals on a dielectric element such as a sheet or plate and moving the sheet or plate away from the chip, and injecting a liquid material to form a compliant layer filling the space between the package element and the dielectric element, and surrounding the leads. The dielectric element and package element extend outwardly beyond the edges of the chip, and physically protect the chip. The assembly may be handled and mounted by conventional surface mounting techniques. The assembly may include additional circuit elements such as capacitors used in conjunction with the chip.

Semiconductor package with heat sink

A flexible sheet used in manufacture of microelectronic components is held on a frame formed from a rigid material so that the frame maintains the sheet under tension during processing and thereby stabilizes the dimensions of the sheet. The frame may be formed from a rigid, light-transmissive material such as a glass, and the bond between the frame and sheet may be made or released by light transmitted through the frame. Preferred features of the framed sheet minimize entrapment of processing liquids such as etch solutions, thereby minimizing carryover of processing solutions between steps. The frame may have contact openings which permit engagement of a metallic layer on the sheet by an electrode carrying electroplating or etching current without disturbing the main portion of the sheet where features are to be formed or treated.

Enhancements in framed sheet processing

A data transmission interconnect assembly capable of transmission speeds in excess of 40 Gbps in which, for example, a line-card is detachably coupled to a backplane using flexible flat cables that are bent to provide a continuous, smooth curve between the connected boards, and connected by a connection apparatus that employs cable-to-cable interface members that are transparent to the transmitted signal waves. Microspring interface members are formed on the contact structure pressed against the cables to provide interface arrangements that are smaller than a wavelength of the transmitted signal. A connector apparatus uses a cam mechanism to align the cables, and then to press the contact structure, having the microspring interface members formed thereon, against the cables. An alterative contact structure uses anisotropic conductive film.

Flexible cable interconnect assembly

Growing community of inventors

Monte Sereno, CA, United States of America

Thomas H DiStefano