Javier A DeLaCruz

San Jose, CA, United States of America

Javier A DeLaCruz

This inventor holds 137 USPTO granted patents and 39 published patent applications and 2 EPO patents, primarily in Bonded Structures (CPC class H01L25-0657). Top assignees: Adeia Semiconductor Bonding Technologies Inc., Adeia Semiconductor Technologies LLC, Invensas Bonding Technologies, Inc.. Active years: 2017-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Javier A DeLaCruz. Retrieved from https://idiyas.com/inventor/javier-a-delacruz

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 137 

% Patents Active = 97.1

 

Average Co-Inventor Count = 3.0

ph-index = 24

Forward Citations = 3,510(Granted Patents)

Forward Citations (Not Self Cited) = 1,965(Dec 10, 2025)


Inventors with similar research interests:

🔬 See more inventors

Location History:

  • Santa Cruz, CA (US) (2018)
  • Santa Clara, CA (US) (2017 - 2021)
  • San Jose, CA (US) (2018 - 2024)

Company Filing History:


Years Active: 2017-2026

Loading Chart...
Loading Chart...
Areas of Expertise:
Bonded Structures
EMI Shielding
3D Interconnects
Embedded Organic Interposer
High Bandwidth
Non-Volatile Memory
Circuit Redundancy
Integrated Voltage Regulator
Optical Waveguides
Chiplet Technology
Stacked IC Structure
Direct-Bonded Interconnects
137 patents (USPTO):Explore Patents

Title: Javier A DeLaCruz: Innovator Extraordinaire in the Field of Integrated Circuit Technology

Introduction:

Javier A DeLaCruz, a renowned inventor and engineer based in San Jose, CA, has made significant contributions to the field of integrated circuit (IC) technology. With an impressive portfolio of 100 patents, DeLaCruz is known for his commitment to pushing technological boundaries and his ability to commercialize innovative products.

Latest Patents:

One of DeLaCruz's recent patents is the "3D Chip Sharing Data Bus," which introduces a novel approach to three-dimensional (3D) circuitry. This invention enables the stacking of multiple IC dies, allowing them to overlap and share interconnect layers that distribute power, clock, and data-bus signals. By utilizing higher-level interconnect layers, DeLaCruz's design optimizes space and enhances performance, revolutionizing the field of IC technology.

Another notable patent by DeLaCruz is the "Direct-Bonded Native Interconnects and Active Base Dies." This invention presents a microelectronic architecture that allows active chiplets to connect directly to an active base die through core-level conductors. By leveraging native interconnects, this design minimizes routing blockages and improves signal quality and timing. The system is also flexible, accommodating diverse interconnect types and chiplets from various process nodes, thereby reducing footprint and power requirements.

Career Highlights:

Throughout his career, DeLaCruz has achieved numerous milestones and received recognition for his exceptional work. His dedication to technological advancements has led to the successful development and commercialization of several innovative products. With a keen eye for identifying market needs and a visionary mindset, DeLaCruz has consistently pushed the boundaries of technology to create products that have garnered widespread acclaim in their respective industries.

Collaborations:

DeLaCruz has had the opportunity to work with top-notch professionals in the industry. Notable collaborations include his tenure at Xcelsis Corporation, where he worked alongside Belgacem Haba, a fellow innovator and electrical engineer. Together, they contributed significantly to the development of cutting-edge IC technology.

DeLaCruz also collaborated with Ilyas Mohammed during his time at Invensas Corporation, where they focused on advancing microelectronic architectures and interconnect technologies. Their collaboration yielded groundbreaking results, as evidenced by DeLaCruz's patented inventions.

Conclusion:

Javier A DeLaCruz's career in the field of integrated circuit technology has been marked by remarkable achievements and groundbreaking innovations. With an extensive patent portfolio and a track record of successful commercialization, DeLaCruz is a highly regarded figure in the industry. His commitment to pushing the boundaries of technology and his ability to identify market needs have helped shape the future of IC technology. As an exceptional inventor and engineer, DeLaCruz continues to inspire aspiring innovators in the field of integrated circuitry and beyond.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…