EPO Patents = 2

Forward Citations = 357

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11 inventors (with patents filed for the assignee):

Cyprian Emeka Uzoh (3 out of 430 patents)

Arkalgud R Sitaram (3 out of 59 patents)

Liang Wang (2 out of 127 patents)

4. Rajesh Katkar (2 out of 227 patents)

5. Gaius Gillman Fountain, Jr (2 out of 109 patents)

6. Javier A DeLaCruz (2 out of 137 patents)

7. Paul M Enquist (2 out of 88 patents)

8. Jeremy Alfred Theil (1 out of 49 patents)

9. Guilian Gao (1 out of 120 patents)

10. Laura Wills Mirkarimi (1 out of 90 patents)

11. Chandrasekhar Mandalapu (1 out of 10 patents)

12. Jr Gaius Gillman Fountain (0 patent)

5 patents: Sort by Forward Citations

1. 10879226 - Stacked dies and methods for forming bonded structures (2020-12-29),

2. 10879212 - Processed stacked dies (2020-12-29),

3. 10879210 - Bonded structures (2020-12-29),

4. 10879207 - Bonded structures (2020-12-29),

5. 10840205 - Chemical mechanical polishing for hybrid bonding (2020-11-17),

Invensas Bonding Technologies, Inc. specializes in advanced semiconductor packaging and bonding technologies. The company focuses on innovative solutions that enhance the performance and reliability of electronic devices. With a commitment to research and development, Invensas aims to provide cutting-edge technologies that meet the evolving needs of the electronics industry. Their expertise includes various bonding techniques that enable efficient integration of components, contributing to the miniaturization and efficiency of modern electronics.

Profile summary based on public USPTO records.

Company Badge

USPTO Data Jan 1 1976 - Sep 29 2026

5 Patents

#767 in San Jose, CA

#12,054 in California

#51,545 in US

San Jose, CA, United States of America

Invensas Bonding Technologies, Inc.