EPO Patents = 2

Forward Citations = 301

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12 inventors (with patents filed for the assignee):

Cyprian Emeka Uzoh (3 out of 406 patents)

Arkalgud R Sitaram (3 out of 58 patents)

Liang Wang (2 out of 122 patents)

4. Rajesh Katkar (2 out of 209 patents)

5. Gaius Gillman Fountain, Jr (2 out of 94 patents)

6. Javier A DeLaCruz (2 out of 130 patents)

7. Paul M Enquist (2 out of 86 patents)

8. Jeremy Alfred Theil (1 out of 44 patents)

9. Guilian Gao (1 out of 110 patents)

10. Laura Wills Mirkarimi (1 out of 82 patents)

11. Chandrasekhar Mandalapu (1 out of 9 patents)

12. Jr Gaius Gillman Fountain (0 patent)

5 patents: Sort by Forward Citations

1. 10879226 - Stacked dies and methods for forming bonded structures (2020-12-29),

2. 10879212 - Processed stacked dies (2020-12-29),

3. 10879210 - Bonded structures (2020-12-29),

4. 10879207 - Bonded structures (2020-12-29),

5. 10840205 - Chemical mechanical polishing for hybrid bonding (2020-11-17),

Invensas Bonding Technologies, Inc. specializes in advanced semiconductor packaging and bonding technologies. The company focuses on innovative solutions that enhance the performance and reliability of electronic devices. With a commitment to research and development, Invensas aims to provide cutting-edge technologies that meet the evolving needs of the electronics industry. Their expertise includes various bonding techniques that enable efficient integration of components, contributing to the miniaturization and efficiency of modern electronics.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 9 2025

5 Patents

#734 in San Jose, CA

#11,720 in California

#50,165 in US

San Jose, CA, United States of America

Invensas Bonding Technologies, Inc.