San Jose, CA, United States of America
Invensas Bonding Technologies, Inc.
Patents = 5
Forward Citations = 299
where 'Filed Patents' based on already Granted Patents
where 'Inventors Filed' based on already Granted Patents
12 inventors (with patents filed for the assignee):
Invensas Bonding Technologies, Inc. specializes in advanced semiconductor packaging and bonding technologies. The company focuses on innovative solutions that enhance the performance and reliability of electronic devices. With a commitment to research and development, Invensas aims to provide cutting-edge technologies that meet the evolving needs of the electronics industry. Their expertise includes various bonding techniques that enable efficient integration of components, contributing to the miniaturization and efficiency of modern electronics.
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