This inventor holds 10 USPTO granted patents and 4 published patent applications and 1 EPO patent. Top assignees: Adeia Semiconductor Bonding Technologies Inc., Invensas Bonding Technologies, Inc.. Active years: 2020-2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
9 out of 1,909 
1 out of 5 Years Active: 2020-2026
Title: Innovations of Chandrasekhar Mandalapu
Introduction
Chandrasekhar Mandalapu is a notable inventor based in Morrisville, NC (US), recognized for his contributions to microelectronic bonding technologies. He holds a total of 9 patents, showcasing his expertise and innovative spirit in the field.
Latest Patents
One of his latest patents is titled "DBI to Si bonding for simplified handle wafer." This invention includes process steps for preparing various microelectronic components for bonding, such as for direct bonding without adhesive. The processes involve providing a first bonding surface on a first surface of the microelectronic components, bonding a handle to the prepared first bonding surface, and processing a second surface of the microelectronic components while they are gripped at the handle. In some embodiments, the processes include removing the handle from the first bonding surface and directly bonding the microelectronic components at the first bonding surface to other microelectronic components. Another significant patent is "Post CMP processing for hybrid bonding." This invention includes process steps for forming openings through stacked and bonded structures. The openings are formed by pre-etching through one or more layers of prepared dies after planarization of the bonding layer and prior to bonding. For instance, the openings are etched through one or more layers of dies to be bonded before bonding the dies to form an assembly.
Career Highlights
Chandrasekhar has worked with several prominent companies in the semiconductor industry, including Adeia Semiconductor Bonding Technologies Inc. and Invensas Bonding Technologies, Inc. His work has significantly advanced the field of microelectronic bonding.
Collaborations
He has collaborated with notable professionals in the industry, including Gaius Gillman Fountain, Jr. and Guilian Gao. These collaborations have contributed to the development of innovative technologies in microelectronics.
Conclusion
Chandrasekhar Mandalapu's contributions to microelectronic bonding technologies through his patents and collaborations highlight his role as a significant inventor in the field. His work continues to influence advancements in microelectronics.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile