The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2025
Filed:
Jul. 15, 2019
Applicant:
Adeia Semiconductor Bonding Technologies Inc., San Jose, CA (US);
Inventors:
Gaius Gillman Fountain, Jr., Youngsville, NC (US);
Guilian Gao, San Jose, CA (US);
Chandrasekhar Mandalapu, Morrisville, NC (US);
Assignee:
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC., San Jose, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); B81C 3/00 (2006.01); H01L 21/768 (2006.01); H01L 21/78 (2006.01); H01L 23/055 (2006.01); H01L 23/10 (2006.01); H01L 23/522 (2006.01); H01L 23/58 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01); H01L 25/16 (2023.01); H01L 25/18 (2023.01); H01L 21/02 (2006.01); H01L 23/367 (2006.01); H01L 23/48 (2006.01); H01L 23/552 (2006.01);
U.S. Cl.
CPC ...
H01L 24/80 (2013.01); B81C 3/001 (2013.01); H01L 21/7684 (2013.01); H01L 21/76879 (2013.01); H01L 21/78 (2013.01); H01L 23/055 (2013.01); H01L 23/10 (2013.01); H01L 23/5226 (2013.01); H01L 23/564 (2013.01); H01L 23/585 (2013.01); H01L 24/05 (2013.01); H01L 24/08 (2013.01); H01L 25/0657 (2013.01); H01L 25/167 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); B81B 2203/0315 (2013.01); B81C 2203/0145 (2013.01); B81C 2203/036 (2013.01); H01L 21/02065 (2013.01); H01L 21/02076 (2013.01); H01L 21/76898 (2013.01); H01L 23/367 (2013.01); H01L 23/481 (2013.01); H01L 23/552 (2013.01); H01L 24/04 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05571 (2013.01); H01L 2224/08121 (2013.01); H01L 2224/08147 (2013.01); H01L 2224/80031 (2013.01); H01L 2224/80357 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/80896 (2013.01); H01L 2225/06537 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06555 (2013.01); H01L 2225/06565 (2013.01); H01L 2225/06589 (2013.01); H01L 2225/06596 (2013.01); H01L 2924/1436 (2013.01); H01L 2924/1461 (2013.01);
Abstract
Devices and techniques include process steps for forming openings through stacked and bonded structures. The openings are formed by pre-etching through one or more layers of prepared dies after planarization of the bonding layer (by chemical-mechanical polishing (CMP) or the like) and prior to bonding. For instance, the openings are etched through one or more layers of dies to be bonded prior to bonding the dies to form an assembly.