The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 29, 2020
Filed:
Dec. 20, 2019
Invensas Bonding Technologies, Inc., San Jose, CA (US);
Paul M. Enquist, Durham, NC (US);
Liang Wang, Milpitas, CA (US);
Rajesh Katkar, San Jose, CA (US);
Javier A. DeLaCruz, San Jose, CA (US);
Arkalgud R. Sitaram, Cupertino, CA (US);
Invensas Bonding Technologies, Inc., San Jose, CA (US);
Abstract
A bonded structure can include a first element having a first interface feature and a second element having a second interface feature. The first interface feature can be bonded to the second interface feature to define an interface structure. A conductive trace can be disposed in or on the second element. A bond pad can be provided at an upper surface of the first element and in electrical communication with the conductive trace. An integrated device can be coupled to or formed with the first element or the second element.