Rajesh Katkar

San Jose, CA, United States of America

Rajesh Katkar

This inventor holds 227 USPTO granted patents and 118 published patent applications and 4 EPO patents, primarily in Bonded Structures (CPC class H01L25-0657). Top assignees: Adeia Semiconductor Bonding Technologies Inc., Adeia Semiconductor Technologies LLC, Invensas Bonding Technologies, Inc.. Active years: 2014-2026.

USPTO Granted Patents = 227 

% Patents Active = 100.0

 

Average Co-Inventor Count = 3.0

ph-index = 35

Forward Citations = 4,321(Granted Patents)

Forward Citations (Not Self Cited) = 2,469(Dec 10, 2025)


Inventors with similar research interests:

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Location History:

  • Milptias, CA (US) (2022)
  • San Jose, CA (US) (2014 - 2024)
  • Milpitas, CA (US) (2018 - 2024)

Company Filing History:


Years Active: 2014-2026

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Areas of Expertise:
Transparent Conductor
Optoelectronic Interconnect
Thermoelectric Cooling
3D NAND
Microelectronic Assembly
Embedded Cooling
Image Sensor
Bonded Optical Devices
Low Temperature Bonding
Multi-Chip Modules
Diffusion Barrier
Electrical Redundancy
227 patents (USPTO):Explore Patents

Title: Rajesh Katkar: A Visionary Engineer Shaping Innovations in Silicon Valley

Introduction:

Rajesh Katkar, a talented engineer and inventor based in San Jose, CA, has made significant contributions to the field of semiconductor technology. With an impressive portfolio of 152 patents, Katkar has demonstrated an unparalleled ability to develop groundbreaking solutions and improve the functionality of electronic devices. This article delves into his latest patents, career highlights, notable collaborations, and the impact he has made in the industry.

Latest Patents:

Katkar's most recent patents showcase his innovative mindset and ability to solve complex challenges in the field of semiconductor technology. One notable invention is the "Molded Direct Bonded and Interconnected Stack," which involves stacking and bonding dies and/or wafers in various configurations. This technique utilizes a molding to improve handling, packaging, and connectivity, while also enhancing thermal management. Another remarkable patent, titled "Bonded Optical Devices," introduces a bonded optical device with multiple optical elements, optical pathways, and optical emitters of different colors. This invention enables the transmission of a superposition of light from different emitters, resulting in enhanced visual experiences for users.

Career Highlights:

Katkar's illustrious career spans numerous high-profile companies, including Invensas Corporation and its subsidiary, Invensas Bonding Technologies, Inc. His innovative abilities have flourished in these environments, where he has played a significant role in revolutionizing the semiconductor industry. Throughout his career, Katkar has consistently delivered groundbreaking solutions, garnering him a reputation as a visionary engineer and esteemed intellectual property creator.

Collaborations:

Katkar's exceptional skills have not gone unnoticed by his peers within the industry. His collaborations with esteemed colleagues, such as Cyprian Emeka Uzoh and Liang Wang, highlight his ability to work in interdisciplinary teams and further push the boundaries of innovation. These partnerships have played a pivotal role in the successful realization of several groundbreaking inventions.

Conclusion:

Rajesh Katkar's impact on the field of semiconductor technology is undeniable. With over 152 patents to his name and a remarkable ability to solve complex challenges, he has consistently pushed the envelope of technological advancements. His recent patents, such as the Molded Direct Bonded and Interconnected Stack, and Bonded Optical Devices, demonstrate his ability to develop cutting-edge solutions that enhance the functionality and performance of electronic devices. As the engineering landscape continues to evolve, Rajesh Katkar remains a prominent figure driving innovation and shaping the future of the industry in Silicon Valley and beyond.

Profile summary based on public USPTO records.
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