Laura Wills Mirkarimi

Laura Wills Mirkarimi, a prolific inventor based in Sunol, California, has made significant contributions to the field of microelectronics with a total of 51 patents to her name. Her latest patents involve innovative techniques for joining dissimilar materials in microelectronics, enabling the direct bonding of materials with significantly different coefficients of thermal expansion (CTEs) and crystal-lattice unit cell geometries. This process involves using a thin intermediary layer made of silicon oxide, carbide, nitride, carbonitride, or oxynitride, with a thickness ranging from 100 to 1000 nanometers. The direct bonds formed between dissimilar materials are then strengthened through curing and a low-temperature annealing process, resulting in considerable bond strength improvements.

One of Laura Wills Mirkarimi's notable inventions includes the ability to direct-bond lithium tantalate (LiTaO) to various conventional substrates, enabling the creation of novel optical and acoustic devices through a specialized manufacturing process.

Throughout her career, Laura Wills Mirkarimi has worked with esteemed companies such as Invensas Bonding Technologies, Inc. and Invensas Corporation, where she has likely collaborated with colleagues like Rajesh Katkar and Cyprian Emeka Uzoh.

Laura's expertise in microelectronics and her numerous patents demonstrate her commitment to advancing the field through innovative solutions for joining dissimilar materials and processing singulated dies. Her contributions have undoubtedly contributed to the development of new technologies and applications in this ever-evolving industry.