The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2026
Filed:
Nov. 02, 2021
Applicant:
Adeia Semiconductor Technologies Llc, San Jose, CA (US);
Inventors:
Cyprian Emeka Uzoh, San Jose, CA (US);
Laura Wills Mirkarimi, Sunol, CA (US);
Assignee:
Adeia Semiconductor Technologies LLC, San Jose, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H10W 20/00 (2026.01); H10W 20/41 (2026.01); H10W 20/42 (2026.01); H10W 20/44 (2026.01); H10W 20/46 (2026.01); H10W 20/48 (2026.01); H10W 70/05 (2026.01); H10W 70/60 (2026.01); H10W 72/00 (2026.01); H10W 72/90 (2026.01); H10W 72/30 (2026.01); H10W 80/00 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 20/46 (2026.01); H10W 20/033 (2026.01); H10W 20/048 (2026.01); H10W 20/072 (2026.01); H10W 20/42 (2026.01); H10W 20/425 (2026.01); H10W 20/4424 (2026.01); H10W 20/48 (2026.01); H10W 70/093 (2026.01); H10W 70/60 (2026.01); H10W 72/019 (2026.01); H10W 72/90 (2026.01); H10W 72/352 (2026.01); H10W 80/016 (2026.01); H10W 80/102 (2026.01); H10W 80/312 (2026.01); H10W 80/327 (2026.01); H10W 90/722 (2026.01); H10W 90/732 (2026.01); H10W 90/734 (2026.01); H10W 90/792 (2026.01); H10W 90/794 (2026.01);
Abstract
A method for forming an interconnect structure in an element is disclosed. The method can include patterning a cavity in a non-conductive material. The method can include exposing a surface of the cavity in the non-conductive material to a surface nitriding treatment. The method can include depositing a conductive material directly onto the treated surface after the exposing.