The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2025
Filed:
Feb. 20, 2024
Adeia Semiconductor Bonding Technologies Inc., San Jose, CA (US);
Guilian Gao, San Jose, CA (US);
Bongsub Lee, Santa Clara, CA (US);
Gaius Gillman Fountain, Jr., Youngsville, NC (US);
Cyprian Emeka Uzoh, San Jose, CA (US);
Laura Wills Mirkarimi, Sunol, CA (US);
Belgacem Haba, Saratoga, CA (US);
Rajesh Katkar, Milpitas, CA (US);
Adeia Semiconductor Bonding Technologies Inc., San Jose, CA (US);
Abstract
Representative techniques and devices including process steps may be employed to mitigate the potential for delamination of bonded microelectronic substrates due to metal expansion at a bonding interface. For example, a metal pad having a larger diameter or surface area (e.g., oversized for the application) may be used when a contact pad is positioned over a TSV in one or both substrates.