Bongsub Lee

Title: Bongsub Lee: Innovations in Microelectronics Bonding

Introduction:

In the fast-paced world of microelectronics, the need for innovative bonding techniques and devices is paramount. Enter Bongsub Lee, a talented inventor based in Mountain View, CA, with a track record of 12 patents under his belt. Lee's groundbreaking work focuses on mitigating delamination in bonded microelectronic substrates due to metal expansion at the bonding interface.

Latest Patents:

Lee's most recent patents revolve around offset pads over TSV (Through-Silicon Via) and large metal pads over TSV. These representative techniques and devices are designed to address the potential delamination issues in bonded microelectronic substrates. By employing various process steps, Lee's inventions ensure the reliability and stability of the bonding interface.

Offset pads over TSV:

To prevent delamination, Lee's innovation introduces a metal pad positioned offset from the TSV in the microelectronic substrate. This offset pad is not only electrically coupled to the TSV but also acts as a protective layer, mitigating the potential for bonded substrates to separate.

Large metal pads over TSV:

In this technique, Lee introduces a metal pad with a larger diameter or surface area, intentionally oversized for the application, when a contact pad is positioned over a TSV. By providing increased structural integrity and enhanced thermal stability, these large metal pads minimize the risk of delamination, ensuring the longevity of bonded microelectronic substrates.

Companies and Collaborators:

Bongsub Lee has made significant contributions to the field of microelectronics bonding technologies while working with esteemed companies such as Invensas Bonding Technologies, Inc. and Invensas Corporation. These organizations have embraced Lee's ingenuity and dedication to developing advanced bonding techniques.

Alongside Lee's expertise, he has collaborated with notable individuals in the field. Rajesh Katkar and Laura Wills Mirkarimi, among other colleagues, have worked closely with Lee, furthering their collective expertise and pushing the boundaries of microelectronics bonding.

Conclusion:

Bongsub Lee's remarkable innovations in the realm of microelectronics bonding have revolutionized the industry by addressing the crucial issue of delamination in bonded microelectronic substrates. Through his patented techniques involving offset pads over TSV and large metal pads over TSV, he has paved the way for enhanced reliability and durability in microelectronic devices. As an inventor and innovator, Lee continues to make significant contributions to the ever-evolving world of microelectronics.