The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 2020
Filed:
Apr. 09, 2019
Applicant:
Invensas Corporation, San Jose, CA (US);
Inventors:
Liang Wang, Newark, CA (US);
Bongsub Lee, Santa Clara, CA (US);
Belgacem Haba, Saratoga, CA (US);
Sangil Lee, Santa Clara, CA (US);
Assignee:
Invensas Corporation, San Jose, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 24/11 (2013.01); H01L 24/17 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H01L 25/50 (2013.01); H01L 2224/1145 (2013.01); H01L 2224/11426 (2013.01); H01L 2224/11452 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/11464 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/16112 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/271 (2013.01); H01L 2224/27003 (2013.01); H01L 2224/2711 (2013.01); H01L 2224/2712 (2013.01); H01L 2224/2746 (2013.01); H01L 2224/2761 (2013.01); H01L 2224/2783 (2013.01); H01L 2224/27334 (2013.01); H01L 2224/27618 (2013.01); H01L 2224/293 (2013.01); H01L 2224/294 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29309 (2013.01); H01L 2224/29311 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29344 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/29355 (2013.01); H01L 2224/29366 (2013.01); H01L 2224/29393 (2013.01); H01L 2224/29411 (2013.01); H01L 2224/29447 (2013.01); H01L 2224/29455 (2013.01); H01L 2224/29499 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81101 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/9211 (2013.01); H01L 2225/06513 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01022 (2013.01); H01L 2924/01024 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/0615 (2013.01); H01L 2924/0635 (2013.01); H01L 2924/0645 (2013.01); H01L 2924/381 (2013.01);
Abstract
A microelectronic assembly including an insulating layer having a plurality of nanoscale conductors disposed in a nanoscale pitch array therein and a pair of microelectronic elements is provided. The nanoscale conductors can form electrical interconnections between contacts of the microelectronic elements while the insulating layer can mechanically couple the microelectronic elements together.