The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 2024
Filed:
May. 07, 2021
Adeia Semiconductor Bonding Technologies Inc., San Jose, CA (US);
Rajesh Katkar, Milpitas, CA (US);
Laura Wills Mirkarimi, Sunol, CA (US);
Bongsub Lee, Mountain View, CA (US);
Gaius Gillman Fountain, Jr., Youngsville, NC (US);
Cyprian Emeka Uzoh, San Jose, CA (US);
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC., San Jose, CA (US);
Abstract
A bonded structure is disclosed. The bonded structure includes a first element and a second element that is bonded to the first element along a bonding interface. The bonding interface has an elongate conductive interface feature and a nonconductive interface feature. The bonded structure also includes an integrated device that is coupled to or formed with the first element or the second element. The elongate conductive interface feature has a recess through a portion of a thickness of the elongate conductive interface feature. A portion of the nonconductive interface feature is disposed in the recess.