The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2026

Filed:

Oct. 17, 2022
Applicant:

Adeia Semiconductor Bonding Technologies Inc, San Jose, CA (US);

Inventors:

Guilian Gao, San Jose, CA (US);

Gaius Gillman Fountain, Jr., Youngsville, NC (US);

Belgacem Haba, Saratoga, CA (US);

Rajesh Katkar, Milpitas, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 23/00 (2006.01); H01L 23/48 (2006.01); H01L 25/065 (2023.01); H10W 20/20 (2026.01); H10W 20/40 (2026.01); H10W 90/00 (2026.01); H10W 80/00 (2026.01); H10W 90/20 (2026.01); H10W 90/26 (2026.01);
U.S. Cl.
CPC ...
H10W 20/497 (2026.01); H10W 20/20 (2026.01); H10W 90/00 (2026.01); H10W 80/312 (2026.01); H10W 80/327 (2026.01); H10W 90/20 (2026.01); H10W 90/26 (2026.01); H10W 90/297 (2026.01); H10W 90/792 (2026.01);
Abstract

Microelectronic devices having stacked electromagnetic coils are disclosed. In one example, a microelectronic device can include a first semiconductor element and a second semiconductor element disposed on the first semiconductor element. The microelectronic device can also include an electromagnetic coil. A first portion of the electromagnetic coil and a second portion of the electromagnetic coil may be spaced apart by the first semiconductor element. A first conductive via extending through the first semiconductor element may connect the first and second portions of the electromagnetic coil. Methods for forming such microelectronic devices are also disclosed.


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