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EPO Patents = 36

Trademarks = 1

Forward Citations = 312

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7 inventors (with patents filed for the assignee):

Cyprian Emeka Uzoh (2 out of 429 patents)

Rajesh Katkar (2 out of 227 patents)

Javier A DeLaCruz (2 out of 136 patents)

4. Stephen L Morein (1 out of 160 patents)

5. Liang Wang (1 out of 127 patents)

6. Hong Shen (1 out of 73 patents)

7. Shaowu Huang (1 out of 51 patents)

8. Belgacem Haba (1 out of 670 patents)

9. Ilyas Mohammed (285 patents)

10. Ronald Dekker (82 patents)

11. Vage Oganesian (137 patents)

12. Moshe Kriman (27 patents)

13. Takafumi Okuma (15 patents)

14. Da-Yuan Shih (101 patents)

15. Johan Hendrik Klootwijk (49 patents)

6 patents: Sort by Forward Citations

1. 12713943 - DIELETS ON FLEXIBLE AND STRETCHABLE PACKAGING FOR MICROELECTRONICS (2026-08-18),

2. 12154858 - Connecting multiple chips using an interconnect device (2024-11-26),

3. 10854578 - Diffused bitline replacement in stacked wafer memory (2020-12-01),

4. 10849240 - Contact structures with porous networks for solder connections, and methods of fabricating same (2020-11-24),

5. 10847562 - Image sensor device (2020-11-24),

6. 10840135 - Flat metal features for microelectronics applications (2020-11-17),

Invensas LLC is a technology company specializing in advanced semiconductor packaging solutions. With a focus on innovation, Invensas develops cutting-edge technologies that enhance the performance and efficiency of electronic devices. Their expertise includes 3D packaging, interconnect solutions, and advanced materials, catering to a wide range of industries including consumer electronics, automotive, and telecommunications. Invensas is committed to driving the future of electronics through sustainable and scalable packaging solutions, enabling their clients to meet the growing demands of the market.

This text is generated by artificial intelligence and may not be accurate.