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Arkalgud R Sitaram is a highly accomplished inventor based in Cupertino, CA, with an impressive track record of 51 patents to his name. Among his latest patents are two notable inventions: Bonded structures and Stacked dies.
The bonded structure patent involves the creation of a structure that includes a first element and a second element, each with their own conductive interface features. An integrated device is connected or formed with one of these elements. The first and second conductive interface features are directly bonded together, forming an annular profile that connects the elements. This invention has potential applications in various industries where secure and reliable connections between components are essential.
In the Stacked dies patent, Sitaram introduces a method for forming a bonded structure. The process begins with mounting a first integrated device die to a carrier and then thinning the die. A first layer is applied to the exposed surface of the thinned die, and a portion of this layer is subsequently removed. To create the bonded structure, a second integrated device die is directly bonded to the first die without the use of an intervening adhesive. This innovation allows for the stacking of multiple dies, enabling more compact and efficient device designs.
Throughout his career, Sitaram has made significant contributions to the field of bonded structures and related technologies. He has worked with renowned companies such as Invensas Bonding Technologies, Inc. and Invensas Corporation. These collaboration opportunities have likely driven Sitaram's expertise and allowed him to further refine his inventions.
Sitaram has had the privilege of working alongside notable coworkers, including Charles Gerard Woychik and Cyprian Emeka Uzoh. Their collective efforts and expertise might have contributed to the advancements and success achieved by Sitaram and the companies he has been associated with.
Arkalgud R Sitaram's patents and inventions demonstrate his dedication to technological innovation and problem-solving. These achievements make him a prominent figure within the field of bonded structures and related technologies, and his contributions continue to shape the landscape of various industries.
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