The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 06, 2021
Filed:
Dec. 18, 2019
Applicant:
Invensas Corporation, San Jose, CA (US);
Inventors:
Cyprian Emeka Uzoh, San Jose, CA (US);
Guilian Gao, San Jose, CA (US);
Liang Wang, Milpitas, CA (US);
Hong Shen, Palo Alto, CA (US);
Arkalgud R. Sitaram, Cupertino, CA (US);
Assignee:
INVENSAS CORPORATION, San Jose, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/82 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 23/538 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 21/82 (2013.01); H01L 21/486 (2013.01); H01L 21/561 (2013.01); H01L 23/5389 (2013.01); H01L 23/562 (2013.01); H01L 24/19 (2013.01); H01L 24/92 (2013.01); H01L 24/94 (2013.01); H01L 24/96 (2013.01); H01L 24/97 (2013.01); H01L 24/98 (2013.01); H01L 23/3128 (2013.01); H01L 24/02 (2013.01); H01L 24/27 (2013.01); H01L 24/32 (2013.01); H01L 2224/0231 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/18 (2013.01); H01L 2224/32146 (2013.01); H01L 2224/92 (2013.01); H01L 2224/94 (2013.01); H01L 2224/96 (2013.01); H01L 2224/97 (2013.01); H01L 2924/157 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15313 (2013.01); H01L 2924/15788 (2013.01); H01L 2924/181 (2013.01); H01L 2924/3511 (2013.01); H01L 2924/3512 (2013.01);
Abstract
A device and method of forming the device that includes cavities formed in a substrate of a substrate device, the substrate device also including conductive vias formed in the substrate. Chip devices, wafers, and other substrate devices can be mounted to the substrate device. Encapsulation layers and materials may be formed over the substrate device in order to fill the cavities.