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Hong Shen

This inventor holds 73 USPTO granted patents and 16 published patent applications and 2 EPO patents, primarily in Microelectronic Packaging (CPC class H01L). Top assignees: Adeia Semiconductor Bonding Technologies Inc., Skyworks Solutions, Inc., Adeia Semiconductor Technologies LLC. Active years: 2011-2026.

USPTO Granted Patents = 73 (Patent Applications = 16)

% Patents Active = 95.9

EPO Patents = 2

Average Co-Inventor Count = 3.0

ph-index = 13

Forward Citations = 1,068(Granted Patents)

Forward Citations (Not Self Cited) = 861(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Camarillo, CA (US) (2011 - 2013)
Oak Park, CA (US) (2014 - 2021)
Palo Alto, CA (US) (2016 - 2024)

Company Filing History:

52 out of 1,904

Adeia Semiconductor Bonding Technologies Inc.

patents

15 out of 2,865

Skyworks Solutions, Inc.

patents

4 out of 31

Adeia Semiconductor Technologies LLC

6. 1 out of 834,307

Other

patents

where one patent can have more than one assignee

Years Active: 2011-2026

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Areas of Expertise:

Thermoelectric Cooling

3D Interconnects

Multichip Modules

Wafer Level Packaging

Integrated Circuits

EMI Shielding

Recyclable Substrates

Solder Connections

Cavity Protection

Device Warpage

HD Color Imaging

Porous Networks

73 patents (USPTO):Sort by Forward CitationsExplore Patents

1. RE51016 - Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies (2026-08-25),

2. RE50965 - System and method for providing 3D wafer assembly with known-good-dies (2026-07-21),

3. 12640483 - Radio frequency device packages (2026-05-26),

4. 12543568 - Thermoelectric cooling for die packages (2026-02-03),

5. 12394728 - Method of forming a region shielding within a package of a microelectronic device (2025-08-19),

6. 12143077 - Power amplifier modules including semiconductor resistor and tantalum nitride terminated through wafer via (2024-11-12),

7. 12040284 - 3D-interconnect with electromagnetic interference ('EMI') shield and/or antenna (2024-07-16),

8. 12021041 - Region shielding within a package of a microelectronic device (2024-06-25),

9. 11335669 - Wafer level chip scale filter packaging using semiconductor wafers with through wafer vias (2022-05-17),

10. 11302616 - Integrated interposer solutions for 2D and 3D IC packaging (2022-04-12),

11. 11205600 - Integrated circuits protected by substrates with cavities, and methods of manufacture (2021-12-21),

12. 11114408 - System and method for providing 3D wafer assembly with known-good-dies (2021-09-07),

13. 11101160 - Device packaging using a recyclable carrier substrate (2021-08-24),

14. 11056390 - Structures and methods for reliable packages (2021-07-06),

15. 10849240 - Contact structures with porous networks for solder connections, and methods of fabricating same (2020-11-24),

Title: Innovations of Hong Shen: A Leader in Semiconductor Technology

Introduction

Hong Shen, based in Palo Alto, CA, is a prominent inventor in the field of semiconductor technology. With an impressive portfolio of 68 patents, he has significantly contributed to advancements in power amplifier modules and microelectronic package design. His work not only showcases his innovative spirit but also his dedication to improving electronic components.

Latest Patents

Among his latest patents, Hong Shen has developed groundbreaking technologies including a power amplifier module that encompasses a power amplifier, a semiconductor resistor, and a tantalum nitride terminated through wafer via. This module integrates a conductive layer directly connecting to the power amplifier, where the semiconductor resistor shares material with the bipolar transistor of the amplifier. Additionally, he has patented a method for manufacturing a microelectronic package featuring an integrally formed electromagnetic interference (EMI) shield and/or antenna, which enhances both functionality and performance by incorporating advanced interconnection and encapsulation techniques.

Career Highlights

Hong has worked with notable companies such as Adeia Semiconductor Bonding Technologies Inc. and Skyworks Solutions, Inc. His tenure at these organizations has allowed him to collaborate on various cutting-edge projects, further solidifying his reputation as an expert in semiconductor innovations.

Collaborations

Throughout his career, Hong has had the pleasure of working alongside talented individuals like Liang Wang and Rajesh Katkar. Their collaborations have undoubtedly enriched the development process of several significant patents, demonstrating the power of teamwork in driving technological advancements.

Conclusion

Hong Shen's contributions to the semiconductor technology landscape are profound and far-reaching. With 68 patents to his name, his innovations in power amplifiers and microelectronic packaging stand as a testament to his expertise and creativity. As he continues to push the boundaries of technology, Hong remains a figure to watch in the ever-evolving field of electronics.

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