The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2026

Filed:

Oct. 20, 2022
Applicant:

Adeia Semiconductor Technologies Llc, San Jose, CA (US);

Inventors:

Belgacem Haba, Saratoga, CA (US);

Hong Shen, Palo Alto, CA (US);

Patrick Variot, Los Gatos, CA (US);

Rajesh Katkar, Milpitas, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 9/04 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/552 (2006.01); H01Q 1/48 (2006.01); H01Q 1/52 (2006.01); H10W 42/20 (2026.01); H10W 74/10 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H01Q 9/045 (2013.01); H01Q 1/48 (2013.01); H01Q 1/526 (2013.01); H10W 42/20 (2026.01); H10W 74/117 (2026.01); H10W 90/701 (2026.01); H10W 90/734 (2026.01);
Abstract

An integrated device package is disclosed. The integrated device package can include an antenna structure and an integrated device die electrically coupled to the antenna structure. The antenna structure can be formed with a system board or separated from the system board. When the antenna structure is formed with the system board, the integrated device package can include a redistribution layer having conductive routing traces such that the integrated device die is disposed between the system board and the redistribution layer, and the integrated device die is electrically coupled to the antenna structure at least partially through the redistribution layer. When the antenna structure is separated from the system board, the integrated device die can be positioned between the antenna structure and the system board, and the integrated device die can be electrically coupled to the antenna structure at least partially through the system board.


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