The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 12, 2024

Filed:

Aug. 17, 2022
Applicant:

Skyworks Solutions, Inc., Irvine, CA (US);

Inventors:

Peter J. Zampardi, Jr., Newbury Park, CA (US);

Hongxiao Shao, Thousand Oaks, CA (US);

Tin Myint Ko, Newbury Park, CA (US);

Matthew Thomas Ozalas, Novato, CA (US);

Hong Shen, Palo Alto, CA (US);

Mehran Janani, Oak Park, CA (US);

Jens Albrecht Riege, Ojai, CA (US);

Hsiang-Chih Sun, Thousand Oaks, CA (US);

David Steven Ripley, Cedar Rapids, IA (US);

Philip John Lehtola, Cedar Rapids, IA (US);

Assignee:

Skyworks Solutions, Inc., Irvine, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/082 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/66 (2006.01); H01L 21/768 (2006.01); H01L 21/78 (2006.01); H01L 21/8249 (2006.01); H01L 21/8252 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01); H01L 23/50 (2006.01); H01L 23/522 (2006.01); H01L 23/552 (2006.01); H01L 23/66 (2006.01); H01L 27/06 (2006.01); H01L 29/08 (2006.01); H01L 29/20 (2006.01); H01L 29/205 (2006.01); H01L 29/36 (2006.01); H01L 29/66 (2006.01); H01L 29/737 (2006.01); H01L 29/812 (2006.01); H03F 1/02 (2006.01); H03F 3/19 (2006.01); H03F 3/195 (2006.01); H03F 3/21 (2006.01); H03F 3/213 (2006.01); H03F 3/24 (2006.01); H03F 3/60 (2006.01); H01L 27/092 (2006.01); H01L 29/06 (2006.01); H01L 29/10 (2006.01); H01L 29/8605 (2006.01); H03F 1/56 (2006.01); H03F 3/187 (2006.01); H03F 3/347 (2006.01); H03F 3/45 (2006.01);
U.S. Cl.
CPC ...
H03F 3/213 (2013.01); H01L 21/485 (2013.01); H01L 21/4853 (2013.01); H01L 21/4864 (2013.01); H01L 21/565 (2013.01); H01L 21/76898 (2013.01); H01L 21/78 (2013.01); H01L 21/8249 (2013.01); H01L 21/8252 (2013.01); H01L 22/14 (2013.01); H01L 23/3114 (2013.01); H01L 23/481 (2013.01); H01L 23/49811 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/49844 (2013.01); H01L 23/49861 (2013.01); H01L 23/49866 (2013.01); H01L 23/50 (2013.01); H01L 23/522 (2013.01); H01L 23/552 (2013.01); H01L 23/66 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 24/85 (2013.01); H01L 24/97 (2013.01); H01L 27/0605 (2013.01); H01L 27/0623 (2013.01); H01L 29/0821 (2013.01); H01L 29/0826 (2013.01); H01L 29/20 (2013.01); H01L 29/205 (2013.01); H01L 29/36 (2013.01); H01L 29/66242 (2013.01); H01L 29/7371 (2013.01); H01L 29/812 (2013.01); H03F 1/0205 (2013.01); H03F 3/19 (2013.01); H03F 3/195 (2013.01); H03F 3/21 (2013.01); H03F 3/245 (2013.01); H03F 3/60 (2013.01); H01L 23/49894 (2013.01); H01L 24/45 (2013.01); H01L 27/092 (2013.01); H01L 29/0684 (2013.01); H01L 29/1004 (2013.01); H01L 29/66863 (2013.01); H01L 29/737 (2013.01); H01L 29/8605 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6644 (2013.01); H01L 2223/665 (2013.01); H01L 2223/6655 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/05164 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48177 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/48611 (2013.01); H01L 2224/48644 (2013.01); H01L 2224/48647 (2013.01); H01L 2224/48655 (2013.01); H01L 2224/48664 (2013.01); H01L 2224/48811 (2013.01); H01L 2224/48816 (2013.01); H01L 2224/48844 (2013.01); H01L 2224/48847 (2013.01); H01L 2224/48855 (2013.01); H01L 2224/48864 (2013.01); H01L 2224/4903 (2013.01); H01L 2224/49111 (2013.01); H01L 2224/49176 (2013.01); H01L 2224/85205 (2013.01); H01L 2224/85207 (2013.01); H01L 2224/85411 (2013.01); H01L 2224/85416 (2013.01); H01L 2224/85444 (2013.01); H01L 2224/85455 (2013.01); H01L 2224/85464 (2013.01); H01L 2924/00011 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/12033 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13051 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/19107 (2013.01); H01L 2924/3011 (2013.01); H01L 2924/30111 (2013.01); H01L 2924/3025 (2013.01); H03F 1/565 (2013.01); H03F 3/187 (2013.01); H03F 3/347 (2013.01); H03F 3/45 (2013.01); H03F 2200/387 (2013.01); H03F 2200/451 (2013.01); H03F 2200/48 (2013.01); H03F 2200/555 (2013.01);
Abstract

One aspect of this disclosure is a power amplifier module that includes a power amplifier, a semiconductor resistor, a tantalum nitride terminated through wafer via, and a conductive layer electrically connected to the power amplifier. The semiconductor resistor can include a resistive layer that includes a same material as a layer of a bipolar transistor of the power amplifier. A portion of the conductive layer can be in the tantalum nitride terminated through wafer via. The conductive layer and the power amplifier can be on opposing sides of a semiconductor substrate. Other embodiments of the module are provided along with related methods and components thereof.


Find Patent Forward Citations

Loading…