The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 2026
Filed:
Dec. 16, 2022
Adeia Semiconductor Bonding Technologies Inc., San Jose, CA (US);
Belgacem Haba, Saratoga, CA (US);
Rajesh Katkar, Milpitas, CA (US);
Patrick Variot, Los Gatos, CA (US);
Hong Shen, Palo Alto, CA (US);
Adeia Semiconductor Bonding Technologies Inc., San Jose, CA (US);
Abstract
In some aspects, the disclosed technology provides microelectronic devices which can effectively dissipate heat and methods of forming the disclosed microelectronic devices. In some embodiments, a disclosed device may include a first integrated device die. The disclosed device may further include a thermoelectric element bonded to the first integrated device die. The disclosed device may further include a heat sink disposed over at least the thermoelectric element. The thermoelectric element may be configured to transfer heat from the first integrated device die to the heat sink. The thermoelectric element directly may be bonded to the first integrated device die without an adhesive.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile