The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 24, 2020
Filed:
Nov. 22, 2019
Applicant:
Invensas Corporation, San Jose, CA (US);
Inventors:
Liang Wang, Newark, CA (US);
Rajesh Katkar, Milpitas, CA (US);
Hong Shen, Palo Alto, CA (US);
Cyprian Emeka Uzoh, San Jose, CA (US);
Assignee:
Invensas Corporation, San Jose, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/40 (2006.01); H05K 1/11 (2006.01); H05K 3/34 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4007 (2013.01); H01L 24/03 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 24/92 (2013.01); H05K 1/111 (2013.01); H05K 3/3431 (2013.01); H01L 21/563 (2013.01); H01L 24/05 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 24/94 (2013.01); H01L 2224/039 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/0346 (2013.01); H01L 2224/0355 (2013.01); H01L 2224/03422 (2013.01); H01L 2224/03452 (2013.01); H01L 2224/03464 (2013.01); H01L 2224/03848 (2013.01); H01L 2224/03912 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/058 (2013.01); H01L 2224/05014 (2013.01); H01L 2224/05015 (2013.01); H01L 2224/05022 (2013.01); H01L 2224/05073 (2013.01); H01L 2224/05082 (2013.01); H01L 2224/05563 (2013.01); H01L 2224/05567 (2013.01); H01L 2224/1132 (2013.01); H01L 2224/1147 (2013.01); H01L 2224/1155 (2013.01); H01L 2224/11334 (2013.01); H01L 2224/11422 (2013.01); H01L 2224/11452 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/11464 (2013.01); H01L 2224/131 (2013.01); H01L 2224/134 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/13239 (2013.01); H01L 2224/13395 (2013.01); H01L 2224/16105 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/274 (2013.01); H01L 2224/2741 (2013.01); H01L 2224/2755 (2013.01); H01L 2224/27452 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/2939 (2013.01); H01L 2224/29187 (2013.01); H01L 2224/29287 (2013.01); H01L 2224/29295 (2013.01); H01L 2224/29299 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73104 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83104 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/9211 (2013.01); H01L 2224/94 (2013.01); H01L 2924/3841 (2013.01);
Abstract
A contact pad includes a solder-wettable porous network () which wicks the molten solder () and thus restricts the lateral spread of the solder, thus preventing solder bridging between adjacent contact pads.