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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11658173 B1

PDFFull Text
Date of Patent:
May. 23, 2023

Filed:

Dec. 22, 2020

Stacked dies and methods for forming bonded structures

Applicant:

Adeia Semiconductor Bonding Technologies Inc., San Jose, CA (US);

Inventors:

Cyprian Emeka Uzoh, San Jose, CA (US);

Arkalgud R. Sitaram, Cupertino, CA (US);

Paul Enquist, Cary, NC (US);

Assignee:

ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC., San Jose, CA (US);

Attorney:

Knobbe, Martens, Olson & Bear LLP

Primary Examiner:

Jasmine J Clark

Int. Cl.
CPC ...
H01L 25/00 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 21/304 (2006.01); H01L 21/306 (2006.01); H01L 21/308 (2006.01); H01L 21/683 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 25/50 (2013.01); H01L 21/304 (2013.01); H01L 21/306 (2013.01); H01L 21/3081 (2013.01); H01L 21/561 (2013.01); H01L 21/683 (2013.01); H01L 23/3121 (2013.01); H01L 23/3135 (2013.01); H01L 25/0657 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06541 (2013.01); H01L 2924/1304 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/351 (2013.01); H01L 2924/3511 (2013.01);
Abstract

In various embodiments, a method for forming a bonded structure is disclosed. The method can comprise mounting a first integrated device die to a carrier. After mounting, the first integrated device die can be thinned. The method can include providing a first layer on an exposed surface of the first integrated device die. At least a portion of the first layer can be removed. A second integrated device die can be directly bonded to the first integrated device die without an intervening adhesive.

Find Patent Forward Citations

Uzoh, Cyprian. (2023). Stacked dies and methods for forming bonded structures (U.S. Patent No. 11658173). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11658173

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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