The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 24, 2024
Filed:
Dec. 28, 2022
Adeia Semiconductor Bonding Technologies Inc., San Jose, CA (US);
Liang Wang, Milpitas, CA (US);
Rajesh Katkar, San Jose, CA (US);
Javier A. DeLaCruz, San Jose, CA (US);
Arkalgud R. Sitaram, Cupertino, CA (US);
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC., San Jose, CA (US);
Abstract
A bonded structure can include a first element having a first conductive interface feature and a second element having a second conductive interface feature. An integrated device can be coupled to or formed with the first element or the second element. The first conductive interface feature can be directly bonded to the second conductive interface feature to define an interface structure. The interface structure can be disposed about the integrated device in an at least partially annular profile to connect the first and second elements.