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For the Inventor, By the Inventor

Poughkeepsie, NY, United States of America

Da-Yuan Shih

USPTO Granted Patents = 101 

 

Average Co-Inventor Count = 4.7

ph-index = 36

Forward Citations = 5,147(Granted Patents)

DiyaCoin DiyaCoin = 2.24 


Inventors with similar research interests:


Location History:

  • Armonk, NY (US) (2014 - 2016)
  • Poughkeepsie, NY (US) (1988 - 2023)

Company Filing History:

goldMedal98 out of 164,108 
 
International Business Machines Corporation
 patents
silverMedal2 out of 135 
 
Ultratech, Inc.
 patents
bronzeMedal1 out of 5,671 
 
Globalfoundries Inc.
 patents

Years Active: 1988-2023

where 'Filed Patents' based on already Granted Patents

101 patents (USPTO):
1. 11541472 - Ultrasonic-assisted solder transfer (2023-01-03),
2. 11270966 - Combination polyimide decal with a rigid mold (2022-03-08),
3. 11110534 - Continuous solder transfer to substrates (2021-09-07),
4. 10833120 - Injection molded microoptics (2020-11-10),
5. 10490594 - Injection molded microoptics (2019-11-26),
6. 9679875 - Reduced volume interconnect for three-dimensional chip stack (2017-06-13),
7. 9543273 - Reduced volume interconnect for three-dimensional chip stack (2017-01-10),
8. 9490408 - Injection molded microoptics (2016-11-08),
9. 9404942 - Coaxial probe structure of elongated electrical conductors projecting from a support structure (2016-08-02),
10. 9343423 - No flow underfill or wafer level underfill and solder columns (2016-05-17),
11. 9305896 - No flow underfill or wafer level underfill and solder columns (2016-04-05),
12. 9252120 - Copper post solder bumps on substrates (2016-02-02),
13. 9082762 - Electromigration-resistant under-bump metallization of nickel-iron alloys for Sn-rich solder bumps in Pb-free flip-clip (2015-07-14),
14. 9012266 - Copper post solder bumps on substrates (2015-04-21),
15. 8963340 - No flow underfill or wafer level underfill and solder columns (2015-02-24),

Title: Inventor Spotlight: Da-Yuan Shih from Poughkeepsie, NY

Introduction:

Da-Yuan Shih, a prolific inventor hailing from Poughkeepsie, NY, has made significant contributions to the field of electronics with a remarkable portfolio of 101 patents. His innovative spirit and groundbreaking work have left a lasting impact on the industry.

Latest Patents:

Among his latest patents is the "Ultrasonic-assisted Solder Transfer," which revolutionizes the process of transferring solder to substrates. Another notable invention is the "Combination Polyimide Decal with a Rigid Mold," designed for creating protruding solder structures for semiconductor devices.

Career Highlights:

Da-Yuan Shih's career is adorned with stints at renowned companies such as IBM (International Business Machines Corporation) and Ultratech, Inc. His expertise and dedication have propelled him to the forefront of technological advancements in the realm of electronics.

Collaborations:

Throughout his career, Da-Yuan Shih has collaborated with esteemed professionals in the industry, including Paul Alfred Lauro and Keith E. Fogel. Together, they have worked on projects that have pushed the boundaries of innovation and paved the way for future developments.

Conclusion:

In conclusion, Da-Yuan Shih stands as a beacon of innovation in the field of electronics, with a remarkable track record of patents and achievements. His pioneering work continues to inspire and shape the future of the industry, cementing his legacy as a visionary inventor.

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