Poughkeepsie, NY, United States of America

Da-Yuan Shih

This inventor holds 101 USPTO granted patents and 11 published patent applications and 3 EPO patents, primarily in Microelectronics Packaging (CPC class H01L24-81). Top assignees: International Business Machines Corporation, Ultratech, Inc., Globalfoundries Inc.. Active years: 1988-2023.

USPTO Granted Patents = 101 (Patent Applications = 11)

% Patents Active = 58.4

EPO Patents = 3 (Patent Applications = 1)

Average Co-Inventor Count = 4.7

ph-index = 36

Forward Citations = 5,157(Granted Patents)

Forward Citations (Not Self Cited) = 5,097(Dec 10, 2025)

Inventors with similar research interests:

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Location History:

Armonk, NY (US) (2014 - 2016)
Poughkeepsie, NY (US) (1988 - 2023)

Company Filing History:

98 out of 166,264

International Business Machines Corporation

Years Active: 1988-2023

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Areas of Expertise:

Solder Transfer

Microoptics

Interconnect Technologies

Chip Cooling

Copper Post Solder Bumps

Electrical Interconnect

Lead-Free Solders

Electromigration Resistance

Underfill Techniques

Metal Adhesion

Probe Structures

Solder Alloy Compositions

101 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11541472 - Ultrasonic-assisted solder transfer (2023-01-03),

2. 11270966 - Combination polyimide decal with a rigid mold (2022-03-08),

3. 11110534 - Continuous solder transfer to substrates (2021-09-07),

4. 10833120 - Injection molded microoptics (2020-11-10),

5. 10490594 - Injection molded microoptics (2019-11-26),

6. 9679875 - Reduced volume interconnect for three-dimensional chip stack (2017-06-13),

7. 9543273 - Reduced volume interconnect for three-dimensional chip stack (2017-01-10),

8. 9490408 - Injection molded microoptics (2016-11-08),

9. 9404942 - Coaxial probe structure of elongated electrical conductors projecting from a support structure (2016-08-02),

10. 9343423 - No flow underfill or wafer level underfill and solder columns (2016-05-17),

11. 9305896 - No flow underfill or wafer level underfill and solder columns (2016-04-05),

12. 9252120 - Copper post solder bumps on substrates (2016-02-02),

13. 9082762 - Electromigration-resistant under-bump metallization of nickel-iron alloys for Sn-rich solder bumps in Pb-free flip-clip (2015-07-14),

14. 9012266 - Copper post solder bumps on substrates (2015-04-21),

15. 8963340 - No flow underfill or wafer level underfill and solder columns (2015-02-24),

Title: Inventor Spotlight: Da-Yuan Shih from Poughkeepsie, NY

Introduction:

Da-Yuan Shih, a prolific inventor hailing from Poughkeepsie, NY, has made significant contributions to the field of electronics with a remarkable portfolio of 101 patents. His innovative spirit and groundbreaking work have left a lasting impact on the industry.

Latest Patents:

Among his latest patents is the "Ultrasonic-assisted Solder Transfer," which revolutionizes the process of transferring solder to substrates. Another notable invention is the "Combination Polyimide Decal with a Rigid Mold," designed for creating protruding solder structures for semiconductor devices.

Career Highlights:

Da-Yuan Shih's career is adorned with stints at renowned companies such as IBM (International Business Machines Corporation) and Ultratech, Inc. His expertise and dedication have propelled him to the forefront of technological advancements in the realm of electronics.

Collaborations:

Throughout his career, Da-Yuan Shih has collaborated with esteemed professionals in the industry, including Paul Alfred Lauro and Keith E. Fogel. Together, they have worked on projects that have pushed the boundaries of innovation and paved the way for future developments.

Conclusion:

In conclusion, Da-Yuan Shih stands as a beacon of innovation in the field of electronics, with a remarkable track record of patents and achievements. His pioneering work continues to inspire and shape the future of the industry, cementing his legacy as a visionary inventor.