The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 07, 2021
Filed:
Apr. 08, 2019
International Business Machines Corporation, Armonk, NY (US);
Jae-Woong Nah, Closter, NJ (US);
Stephen L. Buchwalter, Anthem, AZ (US);
Peter A. Gruber, Mohegan Lake, NY (US);
Da-Yuan Shih, Poughkeepsie, NY (US);
Paul Alfred Lauro, Brewster, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
In an Injection Molded Soldering system, a single, one-layer decal has one or more through hole patterns where each through hole pattern has a plurality of through holes through the decal. A drum with a drum circumference turns while the decal is forced to be adjacent to the drum circumference. The decal passes by a tangent point on the drum circumference where one or more solder-filled through hole patterns align with recessed openings on a substrate at the tangent point of the drum circumference. Applied heat causes the solder structures to melt and flow into the recessed openings.