Mohegan Lake, NY, United States of America

Peter Alfred Gruber

Average Co-Inventor Count = 3.3

ph-index = 22

Forward Citations = 1,758(Granted Patents)

Forward Citations (Not Self Cited) = 1,352(Sep 21, 2024)

DiyaCoin DiyaCoin 0.35 

Inventors with similar research interests:


Location History:

  • Michigan Lake, NY (US) (2003)
  • Yorktown Heights, NY (US) (2011 - 2012)
  • Armonk, NY (US) (2012)
  • Mohegan Lake, NY (US) (1985 - 2023)


Years Active: 1985-2023

where 'Filed Patents' based on already Granted Patents

125 patents (USPTO):

Title: Peter Alfred Gruber: Innovator Extraordinaire with 125 Patents

Introduction:

Peter Alfred Gruber, hailing from Mohegan Lake, NY, is an esteemed inventor who has made significant contributions in the field of ultrasonic-assisted solder transfer. With a remarkable portfolio of 125 patents, Gruber has demonstrated his expertise in creating unique apparatus and methods for transferring solder to substrates. His innovative techniques have earned him recognition in the industry and have revolutionized the electronics manufacturing processes.

Latest Patents:

Among his recent patents, Gruber's noteworthy invention is the "Ultrasonic-assisted Solder Transfer - Apparatus and Methods." This groundbreaking technology involves using ultrasonic vibrations to transfer solder to substrates accurately. The patent describes a system where a substrate belt moves substrates in a particular direction while a decal with solder-filled holes aligns precisely with the substrate locations. By applying ultrasonic vibrations through an ultrasonic head, the solder is effectively transferred to the substrates. This method offers various ways of solder transfer, both with and without external heating.

Another significant patent is Gruber's "Combination Polyimide Decal with a Rigid Mold." This invention enables the creation of protruding solder structures, which serve as electrical attachments for semiconductor devices. By combining a rigid mold with a decal structure, Gruber's innovative method fills the mold and decal openings with solder, resulting in the formation of protruding solder structures. This invention showcases his ability to improve manufacturing processes and enhance electrical connections in the electronics industry.

Career Highlights:

Peter Alfred Gruber has contributed his inventive talents to renowned companies, including International Business Machines Corporation (IBM). During his tenure at IBM, Gruber's relentless pursuit of innovation led to the development of several cutting-edge technologies. His patents have greatly influenced the advancement of electronics manufacturing processes, particularly in the realm of solder transfer techniques. Gruber's career highlights are a testament to his commitment to pushing boundaries and driving technological progress.

Collaborations:

Throughout his career, Gruber has collaborated with exceptional individuals in the field of electrical engineering and manufacturing. Notably, he has worked alongside Jae-Woong Nah and Paul Alfred Lauro, whose expertise and contributions have complemented Gruber's innovative work. Collaborations with such accomplished colleagues have allowed Gruber to further refine his inventions and bring them to fruition. Sharing knowledge and expertise has undoubtedly enriched his journey as an inventor.

Conclusion:

Innovator par excellence, Peter Alfred Gruber, has left an indelible mark on the field of ultrasonic-assisted solder transfer and electronics manufacturing. His impressive portfolio of 125 patents showcases his dedication, creativity, and ingenuity. Gruber's inventions, such as the ultrasonic-assisted solder transfer and the combination polyimide decal with a rigid mold, have revolutionized manufacturing processes and improved electrical connections in the electronics industry. With his continued commitment to innovation, Gruber is poised to make even more significant contributions in the years to come.

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