The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2020

Filed:

Feb. 14, 2018
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Peter A. Gruber, Mohegan Lake, NY (US);

Jae-Woong Nah, Closter, NJ (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 23/48 (2006.01); H01L 23/00 (2006.01); B23K 3/06 (2006.01); B23K 1/00 (2006.01); B23K 26/384 (2014.01); B23K 26/40 (2014.01); B23K 26/382 (2014.01); B23K 101/42 (2006.01); B23K 103/16 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/14 (2006.01);
U.S. Cl.
CPC ...
H01L 23/48 (2013.01); B23K 1/0016 (2013.01); B23K 3/0607 (2013.01); B23K 3/0623 (2013.01); B23K 26/384 (2015.10); B23K 26/389 (2015.10); B23K 26/40 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/14 (2013.01); B23K 2101/42 (2018.08); B23K 2103/16 (2018.08); H01L 21/4853 (2013.01); H01L 23/14 (2013.01); H01L 23/147 (2013.01); H01L 23/49816 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/0347 (2013.01); H01L 2224/03464 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/056 (2013.01); H01L 2224/111 (2013.01); H01L 2224/11003 (2013.01); H01L 2224/11005 (2013.01); H01L 2224/1112 (2013.01); H01L 2224/11436 (2013.01); H01L 2224/11472 (2013.01); H01L 2224/11849 (2013.01); H01L 2224/136 (2013.01); H01L 2224/13017 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/13551 (2013.01); H01L 2224/13561 (2013.01); H01L 2224/81101 (2013.01); H01L 2224/81191 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/12042 (2013.01);
Abstract

A system of producing metal cored solder structures on a substrate includes: a decal, a carrier, and receiving elements. The decal includes one or more apertures each of which is tapered from a top surface to a bottom surface thereof. The carrier is positioned beneath the bottom of the decal and includes cavities in a top surface. The cavities are located in alignment with the apertures of the decal. The decal is positioned on the carrier having the decal bottom surface in contact with the carrier top surface to form feature cavities defined by the decal apertures and the carrier cavities. The feature cavities are shaped to receive one or more metal elements and are configured for receiving molten solder cooled in the cavities. The decal is separable from the carrier to partially expose metal core solder contacts. The receiving elements receive the metal core solder contacts thereon.


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