The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 15, 2018

Filed:

Jul. 13, 2015
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Peter A. Gruber, Mohegan Lake, NY (US);

Jae-Woong Nah, Closter, NJ (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 23/48 (2006.01); H01L 23/00 (2006.01); B23K 3/06 (2006.01); B23K 1/00 (2006.01); B23K 26/384 (2014.01); B23K 26/40 (2014.01); B23K 26/382 (2014.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); B23K 101/42 (2006.01); H01L 23/14 (2006.01); B23K 103/16 (2006.01);
U.S. Cl.
CPC ...
H01L 23/48 (2013.01); B23K 1/0016 (2013.01); B23K 3/0607 (2013.01); B23K 3/0623 (2013.01); B23K 26/384 (2015.10); B23K 26/389 (2015.10); B23K 26/40 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/14 (2013.01); B23K 2201/42 (2013.01); B23K 2203/16 (2013.01); H01L 21/4853 (2013.01); H01L 23/14 (2013.01); H01L 23/147 (2013.01); H01L 23/49816 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/0347 (2013.01); H01L 2224/03464 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/056 (2013.01); H01L 2224/111 (2013.01); H01L 2224/11003 (2013.01); H01L 2224/11005 (2013.01); H01L 2224/1112 (2013.01); H01L 2224/11436 (2013.01); H01L 2224/11472 (2013.01); H01L 2224/11849 (2013.01); H01L 2224/136 (2013.01); H01L 2224/13017 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/13551 (2013.01); H01L 2224/13561 (2013.01); H01L 2224/81101 (2013.01); H01L 2224/81191 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/12042 (2013.01);
Abstract

A system of producing metal cored solder structures on a substrate includes: a decal having a plurality of apertures, the apertures being tapered from a top surface to a bottom surface of the decal; a carrier configured for positioning beneath the bottom of the decal, the carrier having cavities in a top surface and the cavities located in alignment with the apertures of the decal; the decal being configured for positioning on the carrier having the decal bottom surface in contact with the carrier top surface to form feature cavities defined by the decal apertures and the carrier cavities, the feature cavities being shaped to receive a plurality of metal elements therein, the feature cavities configured for receiving molten solder being cooled in the cavities, the decal being separable from the carrier to partially expose metal core solder contacts; and receiving elements of a substrate being configured to receive the metal core solder contacts thereon, and the metal core solder contacts being exposed and positioned on the substrate.


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