International Business Machines Corporation

Globalfoundries Inc.

Ultratech, Inc.

Peter Alfred Gruber

Jae-Woong Nah

Paul Alfred Lauro

Da-Yuan Shih

Stephen L Buchwalter

Steven Alan Cordes

James L Speidell

David Hirsch Danovitch

John Ulrich Knickerbocker

Guy Paul Brouillette

Carlos Juan Sambucetti

Arthur R Zingher

Frederic Maurer

Lannie R Bolde

Chon Cheong Lei

Jae-woong Nah

Daniel George Berger

Stephen Roux

Casimer M DeCusatis

George Frederick Walker

Bruce Kenneth Furman

Claudius Feger

Ephraim Bemis Flint

James H Covell

Philip Charles Danby Hobbs

Michael Liehr

Bing Dang

Russell Alan Budd

Lawrence Jacobowitz

Thomas George Ference

Rajesh S Patel

Christopher Lee Tessler

Kurt R Grebe

Egon Max Kummer

Gary W Grube

Mukta G Farooq

Igor Y Khandros

John Peter Karidis

Kevin Shawn Petrarca

Lubomyr Taras Romankiw

Richard Paul Volant

Konstantinos I Papathomas

Thomas Weiss

Hilton T Toy

Katsuyuki Sakuma

William Thomas Motsiff

David L Edwards

Sung Kwon Kang

Mark David Poliks

Lewis Sigmund Goldmann

Chirag Suryakant Patel

Kazushige Toriyama

Luc Gilbert Guerin

Brian Eugene Curcio

Sherif Ahmed Goma

Matthew J Farinelli

John Joseph Garant

Glen Nelson Biggs

Richard B Booth

Bouwe W Leenstra

Mark Harrison McLeod

George R Proto

Joseph Peter Zinter

Bruce Lee Humphrey

Evan G Colgan

Timothy Joseph Chainer

Gareth Geoffrey Hougham

Fuad Elias Doany

Benjamin V Fasano

Wayne John Howell

Robert Allen Groves

Sudipta Kumar Ray

Raymond R Horton

Michael J Palmer

Shaji Farooq

S Jay Chey

Madhav Datta

Tien-Jen Cheng

Kevin M Prettyman

Donald W Henderson

Philip C Hobbs

Nancy C LaBianca

Judith Marie Rubino

Revathi Iyengar

Dennis G Manzer

Ronald Dean Goldblatt

Phillip W Palmatier

Ronald Franklin Marks

Graham Olive

Jean-Luc Landreville

Guy D Beaumont

Valérie Anne Oberson

Bernardo Hernandez

William S Graham

Bernie Hernandez

Richard F Levine

David T Naugle

Minkailu A Jalloh

Eric E Bourchard

Barry A Hochlowski

Apparatus and methods are disclosed for transferring solder to a substrate. A substrate belt moves one or more substrates in a belt direction. A decal has one or more through holes in a hole pattern that hold solder. Each of the solder holes can align with respective locations on one of the substrates. An ultrasonic head produces an ultrasonic vibration in the solder in a longitudinal direction perpendicular to the belt direction. The ultrasonic head and substrate can be moved together in the longitudinal direction to maintain the ultrasonic head in contact with the solder while the ultrasonic head applies the ultrasonic vibration. Various methods are disclosed including methods of transferring the solder with or without external heating.

Ultrasonic-assisted solder transfer

Protruding solder structures are created for electrical attachment of semiconductor devices. A rigid mold having one or more mold openings is attached to and used in combination with a decal structure that has one or more decal holes. The decal structure is disposed on the rigid mold so that the decal openings are aligned over the mold openings. Each of the decal hole and mold opening in contact form a single combined volume. The single combined volumes are filled with solder to form protruding solder structures. Various structures and methods of making and using the structures are disclosed.

Combination polyimide decal with a rigid mold

In an Injection Molded Soldering system, a single, one-layer decal has one or more through hole patterns where each through hole pattern has a plurality of through holes through the decal. A drum with a drum circumference turns while the decal is forced to be adjacent to the drum circumference. The decal passes by a tangent point on the drum circumference where one or more solder-filled through hole patterns align with recessed openings on a substrate at the tangent point of the drum circumference. Applied heat causes the solder structures to melt and flow into the recessed openings.

Continuous solder transfer to substrates

A wafer-scale apparatus and method is described for the automation of forming, aligning and attaching two-dimensional arrays of microoptic elements on semiconductor and other image display devices, backplanes, optoelectronic boards, and integrated optical systems. In an ordered fabrication sequence, a mold plate comprised of optically designed cavities is formed by reactive ion etching or alternative processes, optionally coated with a release material layer and filled with optically specified materials by an automated fluid-injection and defect-inspection subsystem. Optical alignment fiducials guide the disclosed transfer and attachment processes to achieve specified tolerances between the microoptic elements and corresponding optoelectronic devices and circuits. The present invention applies to spectral filters, waveguides, fiber-optic mode-transformers, diffraction gratings, refractive lenses, diffractive lens/Fresnel zone plates, reflectors, and to combinations of elements and devices, including microelectromechanical systems and liquid crystal device matrices for adaptive, tunable elements. Preparation of interfacial layer properties and attachment process embodiments are taught.

Injection molded microoptics

A system of producing metal cored solder structures on a substrate includes: a decal, a carrier, and receiving elements. The decal includes one or more apertures each of which is tapered from a top surface to a bottom surface thereof. The carrier is positioned beneath the bottom of the decal and includes cavities in a top surface. The cavities are located in alignment with the apertures of the decal. The decal is positioned on the carrier having the decal bottom surface in contact with the carrier top surface to form feature cavities defined by the decal apertures and the carrier cavities. The feature cavities are shaped to receive one or more metal elements and are configured for receiving molten solder cooled in the cavities. The decal is separable from the carrier to partially expose metal core solder contacts. The receiving elements receive the metal core solder contacts thereon.

Metal cored solder decal structure and process

A wafer-scale apparatus and method is described for the automation of forming, aligning and attaching two-dimensional arrays of microoptic elements on semiconductor and other image display devices, backplanes, optoelectronic boards, and integrated optical systems. In an ordered fabrication sequence, a mold plate comprised of optically designed cavities is formed by reactive ion etching or alternative processes, optionally coated with a release material layer and filled with optically specified materials by an automated fluid-injection and defect-inspection subsystem. Optical alignment fiducials guide the disclosed transfer and attachment processes to achieve specified tolerances between the microoptic elements and corresponding optoelectronic devices and circuits. The present invention applies to spectral filters, waveguides, fiber-optic mode-transformers, diffraction gratings, refractive lenses, diffractive lens/Fresnel zone plates, reflectors, and to combinations of elements and devices, including microelectromechanical systems (MEMS) and liquid crystal device (LCD) matrices for adaptive, tunable elements. Preparation of interfacial layer properties and attachment process embodiments are taught.

A system of producing metal cored solder structures on a substrate includes: a decal having a plurality of apertures, the apertures being tapered from a top surface to a bottom surface of the decal; a carrier configured for positioning beneath the bottom of the decal, the carrier having cavities in a top surface and the cavities located in alignment with the apertures of the decal; the decal being configured for positioning on the carrier having the decal bottom surface in contact with the carrier top surface to form feature cavities defined by the decal apertures and the carrier cavities, the feature cavities being shaped to receive a plurality of metal elements therein, the feature cavities configured for receiving molten solder being cooled in the cavities, the decal being separable from the carrier to partially expose metal core solder contacts; and receiving elements of a substrate being configured to receive the metal core solder contacts thereon, and the metal core solder contacts being exposed and positioned on the substrate.

A method of forming a reduced volume interconnect for a chip stack including multiple silicon layers, the method including: forming multiple conductive structures, each of at least a subset of the conductive structures having a volume of conductive material for a corresponding under bump metallurgy pad onto which the conductive structure is transferred that is configured such that a ratio of an unreflowed diameter of the conductive structure to a diameter of the corresponding pad is about one third-to-one or less; transferring the conductive structures to the silicon layers; stacking the silicon layers in a substantially vertical dimension such that each of the conductive structures on a given silicon layer is aligned with a corresponding electrical contact location on an underside of an adjacent silicon layer; and heating the interconnect so as to metallurgically bond multiple electrical contact locations of adjacent silicon layers.

Reduced volume interconnect for three-dimensional chip stack

Multiple injections of molten solder are employed to form double solder bumps having outer layers that melt at lower temperatures than the inner portions thereof. During a flip chip assembly process, the reflow temperature is above the melting temperature of the outer layers and below the melting temperature of the inner portions of the solder bumps. As the inner portions of the solder bumps do not collapse during reflow, a flip chip assembly can be made at relatively low temperatures and have a high stand-off height. A structure having double solder bumps facilitates flip chip assembly.

Double solder bumps on substrates for low temperature flip chip bonding

A fill head apparatus includes at least one chamber for holding a fluid. The chamber has an outlet for expelling the fluid. A vacuum device has an inlet for a suction device adjacent to the fluid outlet. A plurality of flexible and resilient sealing devices contact a top surface of a workpiece. The sealing devices are positioned on opposing sides of the chamber outlet and on opposing sides of the vacuum device inlet, such that the sealing devices create at least a partial seal around a cavity defined by the workpiece and the cavity is beneath both the chamber outlet and the vacuum outlet.

Fill head interface with combination vacuum pressure chamber

A method and system of producing metal cored solder structures on a substrate which includes: providing a decal having a plurality of apertures, the apertures being tapered from a top surface to a bottom surface; positioning a carrier beneath the bottom of the decal, the carrier having cavities located in alignment with the apertures of the decal; positioning the decal on the carrier having the decal bottom surface in contact with the carrier top surface to form feature cavities defined by the decal apertures and the carrier cavities; positioning a plurality of metal elements in the feature cavities; filling the feature cavities with molten solder and cooling the solder; separating the decal from the carrier to partially expose metal core solder contacts; positioning the metal core solder contacts on receiving elements of a substrate; and exposing the metal core solder contacts on the substrate.

Growing community of inventors

Mohegan Lake, NY, United States of America

Peter Alfred Gruber